An application track is a grouping of presentations on a topic of widespread interest across conferences. During submission of the abstract, the submitting author should select an application track if it is relevant to their research. When the program is published online, presentations in an application track can be filtered so they display together in a single view.
Application tracks enable attendees to group and explore presentations in the conference programs to more easily plan their event schedule around the topic of interest. Application track filters span across all conferences at an SPIE event. The ability to group presentations together across the entire event in this way helps participants more easily locate a presentation in their area of interest and has the reciprocal benefit of helping authors' presentations be more easily found.
During submission of the abstract, select an application track if the topic aligns with your research. Adding an application track to your presentation during abstract submission will bring extra visibility to your work and help connect you with colleagues in the community.
Papers that highlight the use of artificial intelligence, machine learning, and deep learning to create and implement intelligent systems across multiple sectors, technologies, and applications.
Papers that highlight the use of optics and photonics for renewable energy, natural resource management, sustainable and green manufacturing, and greenhouse gas mitigation in support of the UN Sustainable Development Goals.
Papers that highlight the development of innovative optics and photonics technologies that increase our understanding of brain physiology and function.
Papers that highlight the transition from bench to bedside using the latest photonics technologies, tools, and techniques for healthcare.
Papers that highlight the innovative use of optics and photonics in multidisciplinary applications for multidimensional manufacturing.
Papers that highlight advances in materials, design, fabrication, integration, testing and packaging of photonic components at the chip level.
