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11-16 April 2026
7 - 11 April 2024
Strasbourg, France
Conference 13002 > Paper 13002-45
Paper 13002-45

Study on laser spot size measurement by scanning-slit method based on back-injection interferometry

11 April 2024 • 15:00 - 15:20 CEST | Dresde/Salon 13, Niveau/Level 1

Abstract

Spot size is an important parameter of the laser, which not only represents the resolution of laser, but is also involved in the calculation of other parameters. Nowadays, CCD imaging systems, scanning imaging systems, and other sensors are used to measure the laser spot size. But they are all lacking flexibility when measuring the spot size in different locations, not to mention their high cost. In this study, a new spot size measurement device based on laser back-injection interferometry was presented. The photodiode integrated with the laser diode was used to collect the feedback laser, then the laser spot size was calculated by the feedback current. A commercial CCD imaging system was used to provide the laser spot size as a reference. Results show that our spot size measurement device could measure the spot size (Full Width Half Maximum) of 5 laser diode modules both in the x (Gaussian-like profile) and y (top-hat-like profile) direction through scanning-slit. Though there are variations between the scanning-slit results and spot sizes from the CCD imaging system due to the diffuse and specular reflection, the accuracy of the spot size measurement device ranges from 96.07 % to 99.46 %, which proves the reliability of our device. It is believed that our device could provide an alternate method for laser spot size measurement, which is cost-effective, easy to operate, and accurate.

Presenter

Yuanfu Tan
The Chinese Univ. of Hong Kong (Hong Kong, China)
Mr. Tan Yuanfu is a phd candidate in the Chinese University of Hong Kong, majoring in mechanical and automation engineering.His research is releated to laser self-mixing interference, aiming to achieve laser beam profiling and geometery measurment based on the laser self-mixing interference,which could be applied in the industry field, such as 3D pringting, laser welding, laser cutting and non-destructive testing.
Presenter/Author
Yuanfu Tan
The Chinese Univ. of Hong Kong (Hong Kong, China)
Author
The Chinese Univ. of Hong Kong (China)
Author
Univ. of Liverpool (United Kingdom)