18 - 22 August 2024
San Diego, California, US
Conference 13115 > Paper 13115-20
Paper 13115-20

Fabrication of superconducting quantum circuits on 12-inch wafers using an ArF immersion lithography system Ⅱ

19 August 2024 • 3:10 PM - 3:30 PM PDT

Abstract

This research explores advances in the fabrication of Josephson junctions, crucial devices in superconducting quantum circuits. Our previous work has successfully fabricated these on a 12-inch substrate using an ArF immersion lithography. To enable future large-scale production, we are moving towards sputtering and dry etching techniques. After initial successful tests on a 4-inch substrate, we have now verified this process on 12-inch substrate fabrication equipment, marking significant progress despite the challenges we have faced.

Presenter

Nikon Corp. (Japan)
Presenter/Author
Nikon Corp. (Japan)
Author
Nikon Corp. (Japan)
Author
Nikon Corp. (Japan)
Author
RIKEN (Japan)
Author
Yasunobu Nakamura
The Univ. of Tokyo (Japan), RIKEN (Japan)
Author
Hiroyuki Tsukamoto
Nikon Corp. (Japan)