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Proceedings Paper

SMO photomask inspection in the lithographic plane
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Paper Abstract

Source Mask Optimization (SMO) describes the co-optimization of the illumination source and mask pattern in the frequency domain. While some restrictions for manufacturable sources and masks are included in the process, the resulting photomasks do not resemble the initial designs. Some common features of SMO masks are that the line edges are heavily fragmented, the minimum design features are small and there is no one-to-one correspondence between design and mask features. When it is not possible to link a single mask feature directly to its resist counterpart, traditional concepts of mask defects no longer apply and photomask inspection emerges as a significant challenge. Aerial Plane Inspection (API) is a lithographic inspection mode that moves the detection of defects to the lithographic plane. They can be deployed to study the lithographic impact of SMO mask defects. This paper briefly reviews SMO and the lithography inspection technologies and explores their applicability to 22nm designs by presenting SMO mask inspection results. These results are compared to simulated wafer print expectations.

Paper Details

Date Published: 23 September 2009
PDF: 8 pages
Proc. SPIE 7488, Photomask Technology 2009, 748807 (23 September 2009); doi: 10.1117/12.830668
Show Author Affiliations
Emily Gallagher, IBM Systems and Technology Group (United States)
Karen Badger, IBM Systems and Technology Group (United States)
Yutaka Kodera, Toppan Photomasks, Inc. (United States)
Jaione Tirapu Azpiroz, IBM Semiconductor Research and Development Ctr. (United States)
Ioana Graur, IBM Semiconductor Research and Development Ctr. (United States)
Scott D. Halle, IBM Systems and Technology Group (United States)
Kafai Lai, IBM Semiconductor Research and Development Ctr. (United States)
Gregory R. McIntyre, IBM Systems and Technology Group (United States)
Mark J. Wihl, KLA-Tencor Corp. (United States)
Shaoyun Chen, KLA-Tencor Corp. (United States)
Ge Cong, KLA-Tencor Corp. (United States)
Bo Mu, KLA-Tencor Corp. (United States)
Zhian Guo, KLA-Tencor Corp. (United States)
Aditya Dayal, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7488:
Photomask Technology 2009
Larry S. Zurbrick; M. Warren Montgomery, Editor(s)

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