
Proceedings Paper
Critical dimension uniformity using reticle inspection toolFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
The Critical Dimension Uniformity (CDU) specification on photomasks continues to decrease with each successive node.
The ITRS roadmap for optical masks indicates that the CDU (3 sigma) for dense lines on binary or attenuated phase shift
mask is 3.4nm for the 45nm half-pitch (45HP) node and will decrease to 2.4nm for the 32HP node. The current
capability of leading-edge mask shop patterning processes results in CDU variation across the photomask of a similar
magnitude.
Hence, we are entering a phase where the mask CDU specification is approaching the limit of the capability of the
current Process of Record (POR). Mask shops have started exploring more active mechanisms to improve the CDU
capability of the mask process. A typical application is feeding back the CDU data to adjust the mask writer dose to
compensate for non-uniformity in the CDs, resulting in improved quality of subsequent masks. Mask makers are
currently using the CD-SEM tool for this application. While the resolution of SEM data ensures its position as the
industry standard and continued requirement to establish the photomask CD Mean to Target value, a dense measurement
of CDs across the reticle with minimal cycle time impact would have value.
In this paper, we describe the basic theory and application of a new, reticle inspection intensity-based CDU approach
that has the advantage of dense sampling over larger areas on the mask. The TeraScanHR high NA reticle inspection
system is used in this study; it can scan the entire reticle at relatively high throughput, and is ideally suited for collecting
dense CDU data. We describe results obtained on advanced memory masks and discuss applications of CDU maps for
optimizing the mask manufacturing process. A reticle inspection map of CDU is complementary to CD-SEM data. The
dense data set has value for various applications, including feedback to mask writer and engineering analysis within the
mask shop.
Paper Details
Date Published: 29 September 2009
PDF: 7 pages
Proc. SPIE 7488, Photomask Technology 2009, 74881O (29 September 2009); doi: 10.1117/12.830148
Published in SPIE Proceedings Vol. 7488:
Photomask Technology 2009
Larry S. Zurbrick; M. Warren Montgomery, Editor(s)
PDF: 7 pages
Proc. SPIE 7488, Photomask Technology 2009, 74881O (29 September 2009); doi: 10.1117/12.830148
Show Author Affiliations
Mark Wylie, KLA-Tencor Corp. (United States)
Trent Hutchinson, KLA-Tencor Corp. (United States)
Gang Pan, KLA-Tencor Corp. (United States)
Thomas Vavul, KLA-Tencor Corp. (United States)
John Miller, KLA-Tencor Corp. (United States)
Aditya Dayal, KLA-Tencor Corp. (United States)
Carl Hess, KLA-Tencor Corp. (United States)
Trent Hutchinson, KLA-Tencor Corp. (United States)
Gang Pan, KLA-Tencor Corp. (United States)
Thomas Vavul, KLA-Tencor Corp. (United States)
John Miller, KLA-Tencor Corp. (United States)
Aditya Dayal, KLA-Tencor Corp. (United States)
Carl Hess, KLA-Tencor Corp. (United States)
Mike Green, Photronics nanoFab North America (United States)
Shad Hedges, Photronics nanoFab North America (United States)
Dan Chalom, Photronics nanoFab North America (United States)
Maciej Rudzinski, Photronics nanoFab North America (United States)
Craig Wood, Photronics nanoFab North America (United States)
Jeff McMurran, Photronics nanoFab North America (United States)
Shad Hedges, Photronics nanoFab North America (United States)
Dan Chalom, Photronics nanoFab North America (United States)
Maciej Rudzinski, Photronics nanoFab North America (United States)
Craig Wood, Photronics nanoFab North America (United States)
Jeff McMurran, Photronics nanoFab North America (United States)
Published in SPIE Proceedings Vol. 7488:
Photomask Technology 2009
Larry S. Zurbrick; M. Warren Montgomery, Editor(s)
© SPIE. Terms of Use
