Dr. Hong Xiao

Dr. Hong Xiao is the Sr. e-beam and processing expert of ASML with expertise in e-beam applications in defect inspection, defect review, and CDU and overlay metrologies of IC chip manufacturing processes. He worked as e-beam technologist of KLA Corp.; technical marketing specialist of Hermes-Microvision, Inc.; and technical manager of Hermes Epitek Corp. He was a Sr. process engineer in Motorola; associate professor of Austin Community College; and Sr. technical instructor of Applied Materials. He received the Ph.D. in physics from the University of Texas at Austin, Dr. Xiao authored and co-authored over 30 journal and conference papers. He has more than 30 patents in US and other countries. He is the author of textbooks, “Introduction to Semiconductor Manufacturing Technology” the 2nd edition published by SPIE Press in Dec. 2012 and “3D IC Devices, Technologies, and Manufacturing” published by SPIE Press in 2016. He is a member of SPIE since 2005 and lifetime member of Chinese American Semiconductor Professional Association.