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Ephraim Suhir

Prof. Ephraim  Suhir

University of California

727 Alvina Ct.
Los Altos CA 94024
United States

tel: 650-969-1530
fax: 650-968-4611
E-mail: suhire@aol.com

Area of Expertise

mechanical and thermodynamic aspects of electronic and photonic packaging


Dr. Suhir is Distinguished Member of Technical Staff (ret), Bell Laboratories, Basic Research, Physical Sciences and Engineering Research Division, Murray Hill, NJ. He is currently on the faculty of the Electrical Engineering Dept. University of California, Santa Cruz, CA. He is also Visiting Professor, Mechanical Engineering Dept., University of Maryland, College Park, MD; and Guest Professor, Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an, China. He is Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Physical Society (APS), the Institute of Physics(IoP), UK, the American Society of Mechanical Engineers(ASME), and the Society of Plastics Engineers (SPE).

Dr.Suhir has been recently elected as Foreign Full Member (Academician) of the National Academy of Engineering and Technological Sciences, Ukraine; as Fulbright Scholar, Council for International Exchange of Scholars (CIES), StateDepartment, US; and as Editor, Silicon Valley Engineering Council (SVEC) Journal. He is Member of the Board of Governors and Distinguished Lecturer of the IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, Associate Editor of the IEEE CPMT Transactions on Advanced Packaging, Member of the ECTC (Electronic Components and Technology Conference) Applied Reliability Subcommittee, the IEEE CPMT award committee, the IEEEFellow nomination committee, and the ASME General Awards committee.

Dr. Suhir is a co-founder of the ASME Journal of Electronic Packaging and served as its Technical Editor for eight years (1993-2001). He has authored about 300 technical publications (patents, papers, book chapters, books), including books “Structural Analysis in Microelectronics and Fiber Optics”, Van-Nostrand, 1991, and “Applied Probability for Engineers and Scientists”, McGraw-Hill, 1997. Dr. Suhir is editor of the Springer book series on physics, mechanics and packaging of microelectronic and photonic systems. He organized many successful conferences and symposia and presented numerous keynote and invited talks worldwide.

Dr. Suhir received many professional awards, including: 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems (he is the third Russian American, after Steven Timoshenko and Igor Sikorsky, who received this prestigious award); 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies infields encompassed by the CPMT Society; 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering; 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering, and 1996 Bell Laboratories Distinguished Member of Technical Staff Award for developing extremely accurate and robust engineering mechanics methods for predicting the reliability, performance, and mechanical behavior of complex structures used in manufacturing Lucent Technologies products.

Lecture Title(s)

Do photonic industries need new approaches to qualify their products?

Dynamic response of opto-electronic and photonic systems to shocks and vibrations

Adhesively bonded and solde assemblies in opto-electronics and photonics

Optical Fiber Interconnects: Design for Reliability
We address the mechanical behavior and reliability of bare and coated optical silica fibers and provide recommendations for their design for reliability (DfR), including probabilistic DfR (PDfR), i.e. the projected probability of failure in the field. We indicate also the role of predictive modeling and the advantages of using nano-materials in the PDfR of optical fuber interconnects. Long-haul communication fibers are considered, as far as their mechanical behavior and reliability is concerned, as an important special case of optical fibers of finite length, such as interconnects. We address also reliability problems associated with crystal photonic fibers (CPF) and their splices with regular fibers. The general concepts are illustrated by numerous practical examples.

Probabilistic Design for Reliability

We address a new approach to the physical design for reliability (DfR) of opto-electronic and photonicn systems, namely a probabilistic (PDfR). The approach enables one, using failure oriented accelerated testing (FOAT), combined with predictive modeling techniques and sensitivity analyses, to design an opto-electronic or a photonic assembly, device or a system with the predicted, assured and, if necessary, even controlled, adequate probability of failure in the field. The concept is illustrated by numerous practical examples.

Thermal stress failures in opto-electronics and photonics: prediction and prevention

We address the causes of elevated thermal stresses in opto-electronic and photonic systems and show how predictive modeling, and especially analytical ("mathematical") modeling can be effectively employed to predict the magnitude and the distribution of these stresses and provide recommendations for stress minimization. We show also how methods of probabilistic risk management (PRM) can be used to predict the probability of thermal stress related failures in the field.

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