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Palomar Technologies, Inc.




Palomar Technologies, Inc.
6305 El Camino Real
Carlsbad, CA
United States

Company video


27 September 2021
Palomar Technologies new 3880-II Die Bonder Maximizes Productivity from R&D to Volume, Automated Bonding
Palomar Technologies new 3880-II Die Bonder Maximizes Productivity from R&D to Volume, Automated Bonding A solid investment in a die bonder designed to grow as production grows Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their new Palomar 3880-II Die Bonder. The new Palomar 3880-II die bonder is based on Palomar’s proven 3880 die bonder design but now includes options to even further maximize productivity, reduce programming time by up to 95% and improve the overall bonder productivity. “We are excited to launch this upgraded version of our long-standing, flexible die bonder. The new Palomar 3880-II Die Bonder builds upon the proven engineering of our previous bonders in the Palomar family, the Palomar 3500, 3800 and 3880 die bonders,” said Rich Hueners, Vice President of Sales and Marketing for Palomar Technologies. “Users of the 3880-II can expect the same unparalleled flexibility in the 3880-II with support for eutectic, epoxy, solder paste, inspection, tracking, sorting, all in one machine that can continually scale up in automation and volume. It represents a solid investment for all customers from R&D up to volume, automated bonding.” The Palomar 3880-II Die Bonder maximizes productivity with a number of improvements, including: • Support for rapid process development that minimizes gaps in production caused by maintenance, calibrations, and process set-ups. • Simultaneously supports multiple types of processes, automation equipment and custom systems with all equipment installed in one large work envelope. • A new tool changer providing automated access to nearly unlimited tools. • Palomar’s Vision Standardization™ software that calibrates images between different Palomar bonding systems, dramatically eliminating the time and cost associated with maintaining programs across multiple systems and numerous programs on a system over time. • A smart tray feeder that saves space for high mix, highly complex environments that can present up to 180 unique components simultaneously. • A new contactless height measurement for quick and precise height measurement. • Improved force range with both precision low forces and robust forces up to 10kg Additionally, the 3880-II can reduce programming time by up to 95% with: • Simplified process creation for even the most complex assemblies with offline programming to import data from CAD designs. • Expedited program creation through easy to use software with simple component source location definitions. • Graphical tools that speed up process creation and provide easy to understand feedback. • Support to utilize any previously defined data from across machines to quickly build up complex assemblies. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications by providing a large work envelope with an open platform for hardware mounting. Typical applications for the Palomar 3880-II Die Bonder include: • AOC - Active optical cable • Chip-on-board • CMOS sensors • GaN/GaAs MMIC • HB/HP LED assembly • HPLD (high power laser diode) • Hybrid microcircuits • LiDAR • Medical semiconductor & sensors • MEMS / MOEMS • Microwave modules • Power electronics • Quantum computing • RF GaN 5G power amplifiers • RF packages • RF power amplifier • VCSEL, PD, DFB Laser, Lens Attach For more information on the Palomar 3880-II Die Bonder, visit: Palomar 3880-II Die Bonder.
27 September 2021
Bay Photonics Targets Fine Pitch Placement of Flip-Chip Photonics Devices Utilizing Palomar 3880 Die Bonder
Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Bay Photonics is working on projects that require the placement and bonding of flip-chip photonics devices that require the use of specialized equipment and are using a Palomar 3880 die bonder in the process. Bay Photonics, a UK-based company specializing in advanced photonics assembly and packaging is involved in the prototype development stage of projects requiring fine pitch of hundreds of bonding pads, some at 60-micron level. The Palomar 3880 die bonder recently purchased by EPIC Paignton is being utilized to ensure that the final layout of the photonic ICs (PICs) is suitable for the targeted assembly and packaging processes. Glenn George, Managing Director of Bay Photonics commented: “I am particularly pleased that prospective customers have contacted us to help with these highly accurate PIC assembly and packaging projects. It’s exciting to see that the idea of creating a hub for Photonics development at EPIC is working, not only from Bay Photonics perspective of moving to this fantastic building, but also involving the eco-system that EPIC brings, using machinery that Palomar have commissioned and the willingness of EPIC and Palomar Technologies to help accomplish these advanced photonics technology requirements.” Bay Photonics founded with former employees of Nortel/Bookham, Gooch & Housego, and Eltek Semiconductor have a deep understanding of the capabilities are of the various assembly methods for specific photonics applications and how to use that knowledge for building commercial prototypes that could transition to production volumes if so desired. Josef Schmidl, Managing Director EMEA for Palomar Technologies said, “We are thrilled to work closely with Bay Photonics, particularly in this area of advanced photonics packaging. Today’s photonics applications are becoming extremely complicated and with our vision to create simple solutions for complex processes, we are dedicated to finding solutions for our customers. Our focus in placing our equipment with EPIC is to enable our customers to realize the high growth potential opportunities that are available in these exciting, rapidly evolving industry sectors.” About Palomar Technologies Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI. With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services. Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, UK, Singapore, and China. For more information, visit: About Bay Photonics Bay Photonics are an independent Photonics IC (PIC) assembly and packaging company. Helping innovative projects from the research/bread board stage through to volume production. Academic and commercial projects accepted. They specialize in helping build prototypes that require a flexible and technically innovative approach to package design, assembly and test of devices. Designs requiring single fibre(s), fibre arrays and micro-optics are our specialty. Having worked at world leading opt-electronic component manufacturers, our technical team have vast experience in developing the right packaging and production solution for PICs in various applications including datacom, quantum and medical amongst others. Located in the South West of the UK, with our main office in Paignton at the Electronics & Photonics Innovation Centre (EPIC), we are housed with other members of the Torbay Photonics Cluster ecosystem and together, offer extended expertise and capability., email: About the Electronic and Photonics Innovation Centre (EPIC) EPIC is managed by TDA, a trading name of Torbay Economic Development Company Limited. As a Centre of Excellence, EPIC will provide the ideal environment for both small and large technology companies within the sector. The Centre will provide opportunities for collaboration, R&D, design, new product development. The facility has established links with academia and research institutes, and other European clusters as well as looking to develop global partnerships. Companies wishing to benefit from the world class facilities at the White Rock site should contact the Centre Director Wayne Loschi on For more information, visit:
27 September 2021
Palomar Technologies new 8100 Wire Bonder Increases Productivity and Efficiency
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their new Palomar 8100 Wire Bonder. The new 8100 wire bonder is a fully automated, thermosonic high-speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design, the Palomar 8100 incorporates the latest productivity technology and operator ergonomics. “The new Palomar 8100 Wire Bonder builds upon the proven engineering of the Palomar 8000, while adding the latest technology in motion control, software and user experience. Transferring and maintaining programs across multiple systems is straightforward and requires no extra effort whether the systems are all 8100s or a mix of 8000s and 8100s,” said Rich Hueners, Vice President of Sales and Marketing for Palomar Technologies. “The Palomar 8000 Wire Bonder has had a successful 17-year run with a global installed base of more than $100M. It is the ball bonder of choice for Tier 1 companies who require high reliability, first-level interconnect in their advanced microelectronic packages. With new features such as Vision Standardization™, customers will find that moving from the 8000 to 8100 will be a seamless transition.” The Palomar 8100 is ideal for a flexible range of applications by providing new methods for higher quality and reliability. It offers optimum performance for applications with tight spaces, fragile surfaces, flip-chip, deep access cavities and provides excellent material flexibility. Typical applications for the Palomar 8100 Wire Bonder include: • Large complex hybrids • HB/HP LED arrays • Optoelectronic packaging • Chip-on-board (COB) • System in packages (SiPs) • Specialty lead frames • Automotive assemblies • Flex circuits • Multi-chip modules (MCMs) • Fine pitch devices • LEDs with running stitch In addition to utilizing Palomar’s VisionPilot® Pattern Referencing software for vision processing, programmers can improve yield and utilization by using Bond Data Miner. This Palomar proprietary software provides traceability of bond parameters and a clear overview of processes and performance. Additionally, it includes Vision Standardization™, Palomar’s new software that calibrates images between different Palomar bonding systems, dramatically eliminating the time and cost associated with maintaining programs across multiple systems and numerous programs on a system over time. The Palomar 8100 is loaded with a full range of ergonomic features designed to increase operator efficiency and decrease fatigue, including: • An optimized wire-feed path for faster loading and full view of the wire during operation • All user interaction points comfortably within operator reach • Adjustable, articulating monitors and keyboard to cater to all operators, either sitting or standing • Microscope available for use while the bonder is in operation • Graphical real-time displays of all vital operations and gauges in one location • Rapid, informed response by employing simple color-coded error signals for all situations