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Denver, Colorado, United States
4 - 8 March 2018
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Applied technologies for nondestructive evaluation, structural health monitoring, advanced materials, and engineered biorobotics

Plan to attend SPIE Smart Structures + Nondestructive Evaluation 2018
SPIE Smart Structures + Nondestructive Evaluation showcases the latest research in advanced materials, electroactive polymers (EAP), bioinspiration and biomimetics for robotics design, along with energy harvesting, sensor networks, nondestructive evaluation (NDE) and structural health monitoring (SHM) for automotive, aerospace, civil infrastructure, smart factories, and Industry 4.0.

Author Notification
30 October 2017

Manuscripts Due
5 February 2018

Registration opens soon

The 2018 Call for Papers is now open

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Download the 2018 Call for Papers PDF
2018 Submission Guidelines

Plan to participate - see how best to apply your research

How will you research contribute?

2018 will offer a special focus on emerging topics: 3D Printing, Wearable Sensors, Signal Processing, Big Data Analytics, Assistive Technologies, Industry 4.0, and Smart Factories. Review the list of conferences to see where your research fits best.

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