SPIE Smart Structures + Nondestructive Evaluation conferences

Explore the latest technologies for automotive, aerospace, civil infrastructure, and Industry 4.0

Featuring nine conference topics

Present your research at SPIE Smart Structures + NDE 2024. We welcome your participation as we look to build another outstanding program.

Review the conference topics listed below or click through to browse the details and see which best fits your area of research.

Speaker at technical conference at SPIE Smart Structures

Conference topics

  • Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation
  • Electroactive Polymer Actuators and Devices (EAPAD)
  • NDE 4.0, Predictive Maintenance, Communication, and Energy Systems: The Digital Transformation of NDE
  • Health Monitoring of Structural and Biological Systems
  • Soft Mechatronics and Wearable Systems
  • Bioinspiration, Biomimetics, and Bioreplication
  • Behavior and Mechanics of Multifunctional Materials
  • Active and Passive Smart Structures and Integrated Systems
  • Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems

2024 Symposium Chairs

Haiying Huang

The Univ. of Texas at Arlington (United States)

Hani Naguib

Univ. of Toronto (Canada)

2024 Symposium Co-chairs

Asha J. Hall

DEVCOM Army Research Lab.
(United States)

Jae-Hung Han

KAIST
(Korea, Republic of)

2024 Organzing Committee

Saman Farhangdoust, Stanford Univ. (United States)

Branko Glisic, Princeton Univ. (United States)

Mariantonieta Gutierrez Soto, The Pennsylvania State Univ. (United States)

Andrew Gyekenyesi, Ohio Aerospace Institute (United States)

Guoliang Huang, Univ. of Missouri (United States)

Sangwoo Kim, Yonsei Univ. (Korea, Republic of)

Mato Knez, CIC nanoGUNE Consolider (Spain)

Akhlesh Lakhtakia, The Pennsylvania State Univ. (United States)

Xiaopeng Li, Toyota Research Institute, North America (United States)

Maria Pina Limongelli, Politecnico di Milano (Italy)

John D. Madden, The Univ. of British Columbia (Canada)

Russell Mailen, Auburn Univ. (United States)

Raúl Martín-Palma, Univ. Autónoma de Madrid (Spain)

Norbert Meyendorf, Fraunhofer IKTS (Germany) and Univ. of Dayton (United States)

Ching Tai Ng, The Univ. of Adelaide (Australia)

Christopher Niezrecki, Univ. of Massachusetts Lowell (United States)

Mostafa Nouh, Univ. at Buffalo (United States)

Il-Kwon Oh, KAIST (Korea, Republic of)

Kara Peters, North Carolina State Univ. (United States)

Maurizio Porfiri, NYU Tandon School of Engineering (United States)

Fabrizio Ricci, Univ. degli Studi di Napoli Federico II (Italy)

Piervincenzo Rizzo, Univ. of Pittsburgh (United States)

Stefan Seelecke, Lehrstuhl für intelligente Materialsysteme (Germany)

Shima Shahab, Virginia Polytechnic Institute and State Univ. (United States)

Peter Shull, The Pennsylvania State Univ. (United States)

Anne Ladegaard Skov, Technical Univ. of Denmark (Denmark)

Zhongqing Su, The Hong Kong Polytechnic Univ. (Hong Kong, China)

Serife Tol, Univ. of Michigan (United States)

Aimy Wissa, Princeton Univ. (United States)

H. Felix Wu, U.S. Dept. of Energy (United States)

Jinkyu Yang, Univ. of Washington (United States)

Woon-Hong Yeo, Georgia Institute of Technology (United States)

Tzuyang Yu, Univ. of Massachusetts Lowell (United States)