IS&T/SPIE Electronic Imaging is the must-attend event for all aspects of electronic imaging, including imaging systems, image processing, image quality, and algorithms.
IS&T/SPIE Electronic Imaging 2011 concluded 27 January.
Attendees heard oral and interactive paper presentations on CCD, CMOS sensors, digital photography, color hardcopy, human vision, image processing and compression, stereoscopic displays, image quality, and multimedia imaging systems.
Download the Final Program (PDF).
View the Electronic Imaging 2011 Abstracts
The following topics were addressed:
- 3D Imaging, Interaction and Measurement
- Imaging, Visualization, and Perception
- Image Processing
- Digital Imaging Sensors and Applications
- Multimedia Processing and Applications
- Visual Information Processing and Communication
Symposium Chair:
Sabine Süsstrunk
Ecole Polytechnique Federale de Lausanne (Switzerland)
Symposium Cochair:
Majid Rabbani
Eastman Kodak Co. (United States)
Short Course Chair:
Gaurav Sharma
Univ. of Rochester (United States)
Short Course Cochair:
Geoff Wolfe
Canon Information Systems Research Australia Pty Ltd. (Australia)
Symposium Steering Committee:
Sabine Süsstrunk, Symposium Chair, École Polytechnique Fédérale de Lausanne (Switzerland)
Majid Rabbani, Symposium Cochair, Eastman Kodak Co.
Jan P. Allebach, Past Symposium Chair, Purdue Univ.
Gaurav Sharma, Short Course Chair, Univ. of Rochester
Nitin Sampat, Rochester Institute of Technology
Suzanne E. Grinnan, IS&T Executive Director
Jeanne Anderson, SPIE Event Manager
Ron L. Scotti, SPIE Science & Technology Advisor
Short Course Chair:
Gaurav Sharma, Univ. of Rochester
Short Course Cochair:
Geoff Wolfe, Canon Information Systems Research Australia Pty Ltd. (Australia)
Technical Organizing Committee:
Gady Agam, Illinois Institute of Technology (United States)
David Akopian, The Univ. of Texas at San Antonio (United States)
Adnan M. Alattar, Digimarc Corp. (United States)
Jan P. Allebach, Purdue Univ. (United States)
Jaakko T. Astola, Tampere Univ. of Technology (Finland)
Atilla M. Baskurt, Univ. of Lyon (France)
Anna Bentkowska-Kafel, King's College London (United Kingdom)
J. Angelo Beraldin, National Research Council Canada (Canada)
Philip R. Bingham, Oak Ridge National Lab. (United States)
Charles A. Bouman, Purdue Univ. (United States)
Matthias F. Carlsohn, Univ. Bremen (Germany)
David P. Casasent, Carnegie Mellon Univ. (United States)
Chaomei Chen, Drexel Univ. (United States)
Geraldine S. Cheok, National Institute of Standards and Technology (United States)
Jim Coddington, Museum of Modern Art (United States)
Reiner Creutzburg, Fachhochschule Brandenburg (Germany)
Edward J. Delp, Purdue Univ. (United States)
Jana Dittmann, Otto-von-Guericke-Univ. Magdeburg (Germany)
Neil A. Dodgson, Univ. of Cambridge (United Kingdom)
Margaret Dolinsky, Indiana Univ. (United States)
Karen O. Egiazarian, Tampere Univ. of Technology (Finland)
Reiner Eschbach, Xerox Corp. (United States)
Zhigang Fan, Xerox Corp. (United States)
Susan P. Farnand, Rochester Institute of Technology (United States)
David Fofi, Univ. de Bourgogne (France)
Frans Gaykema, Océ Technologies B.V. (Netherlands)
Onur G. Guleryuz, DoCoMo Communications Labs. USA, Inc. (United States)
Ernest L. Hall, Univ. of Cincinnati (United States)
Ming C. Hao, Hewlett-Packard Labs. (United States)
Nicolas S. Holliman, Durham Univ. (United Kingdom)
Francisco H Imai, Canon Development Americas Inc. (United States)
Nasser Kehtarnavaz, The Univ. of Texas at Dallas (United States)
Lyndon Kennedy, Yahoo! Research (United States)
Qian Lin, Hewlett-Packard Labs. (United States)
I-Jong Lin, Hewlett-Packard Labs. (United States)
Gabriel G. Marcu, Apple Inc. (United States)
Mike McCarthy, National Physical Lab. (United Kingdom)
Ian E. McDowall, Fakespace Labs, Inc. (United States)
Nasir D. Memon, Polytechnic Institute of NYU (United States)
Ulrich Neuschaefer-Rube, Physikalisch-Technische Bundesanstalt (Germany)
Valérie Nguyen, CEA Leti MINATEC (France)
John D. Owens, Univ. of California, Davis (United States)
Thrasyvoulos N. Pappas, Northwestern Univ. (United States)
Jinah Park, Information and Communications Univ. (Korea, Republic of)
Ilya Pollak, Purdue Univ. (United States)
Alessandro Rizzi, Univ. degli Studi di Milano (Italy)
Bernice E. Rogowitz, Visual Perspectives Consulting (United States)
Juha Röning, Univ. of Oulu (Finland)
Amir Said, Hewlett-Packard Labs. (United States)
Nicu Sebe, Univ. degli Studi di Trento (Italy)
Cees G. M. Snoek, Univ. van Amsterdam (Netherlands)
Robert L. Stevenson, Univ. of Notre Dame (United States)
David G. Stork, Ricoh Innovations, Inc. (United States)
Christian Viard-Gaudin, Univ. of Nantes (France)
Ralf Widenhorn, Portland State Univ. (United States)
Patrick J. Wolfe, Harvard Univ. (United States)
Pak Chung Wong, Pacific Northwest National Lab. (United States)
Andrew J. Woods, Curtin Univ. (Australia)
Feng Xiao, Fairchild Imaging (United States)
Yu-Jin Zhang, Tsinghua Univ. (China)
