SPIE Advanced Lithography brings together the most innovative minds in optical lithography, resists, metrology, EUV, immersion, double patterning, DFM, and imprint lithography.
SPIE Advanced Lithography 2010 concluded 25 February. Dates for 2011 are confirmed: 27 February - 4 March in San Jose, California, USA.
View the current Advanced Lithography website
Advanced Lithography 2010 featured plenary presentations from industry leaders, over 2,100 attendees, and a successful exhibition.
See information on all aspects of the 2010 event:
<class="head6" />The event featured conferences, courses, and an exhibition covering:
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EUV—sources, components, yields, resists, modeling |
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Alternative Technologies—maskless, nano-imprint, directed self-assembly |
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Optical lithography—computational, double patterning, SMO, OPC, RET |
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Metrology, inspection, process control, LER/LWR, mask litho, DBM |
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Resists materials and processing, double patterning, immersion, LER |
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DFM/DPI—co-optimization, layout, electrical, methodologies |
Plenary Speakers:
Kazuo Ushida
President
Precision Equipment Co.
Nikon Corp. |
Eric Chen
Managing Director
Silver Lake Partners |
Sam Sivakumar
Director of Lithography
Portland Technology Development Group
Intel Corp. |
Symposium Chairs:
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Christopher J. Progler
Photronics Inc.
2010 Symposium Chair |
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Donis G. Flagello
Nikon Research Corp. of America
2010 Symposium Co-Chair |
Executive Committee
Robert D. Allen, IBM Almaden Research Ctr.
Will Conley, Freescale Semiconductor, Inc.
Mircea V. Dusa, ASML US,Inc.
Donis G. Flagello, Nikon Research Corp. of America
Daniel J. C. Herr, Semiconductor Research Corp.
Bruno La Fontaine, GLOBALFOUNDRIES Inc.
Patrick P. Naulleau, Lawrence Berkeley National Lab.
Christopher J. Progler, Photronics, Inc.
Christopher J. Raymond, Nanometrics, Inc.
Michael L. Rieger, Synopsys, Inc.
Mark H. Somervell, Tokyo Electron America, Inc.
Alexander Starikov, I&I Consulting
Joerg Thiele, Qimonda AG (Germany)
William M. Tong, Consultant
Advisory Committee
Robert D. Allen, IBM Almaden Research Ctr.
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Roxann L. Engelstad, Univ. of Wisconson, Madison
Roderick R. Kunz, MIT Lincoln Lab.
Harry J. Levinson, Advanced Micro Devices, Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chris A. Mack, lithoguru.com
Victor Pol, Freescale Semiconductor, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den Hove, IMEC (Belgium)
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
