• Advanced Lithography
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San Jose Convention Center
San Jose, California, United States
24 - 28 February 2019
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Plan to Participate

The SPIE Advanced Lithography Symposium has been the showcase of the latest advances in lithography and patterning technology for over four decades. The 2019 symposium will cover the full spectrum of the advances and challenges in state-of-the art lithography technology through several topical conferences. Advances in areas of nano- and micro-patterning for semiconductor IC device application will be presented in sessions devoted to optical lithography, extreme-UV (EUV) lithography, metrology/inspection, patterning materials, etch/deposition technology, and process/technology optimization. As novel patterning and non-IC lithography technologies have become more widely explored, related topics in these areas are also addressed. This year’s symposium is structured into the following seven conferences, each organized by current practitioners of the art working together with organizing committees of experts in these fields.

This year joint sessions between the conferences will be aligned with several predefined "Topical Sessions" (for example: Machine Learning, stochastic effects, 3D device patterning,..) this will offer attendees the opportunity to cover important topics common across these interest areas and minimize same topic presentation overlap. Additionally, the Novel Patterning conference will expand to now include MEMS, NEMS and MEOMS and will include an invited session from industry leaders in this field.

2019 SPIE Advanced Lithography Conferences
-Extreme Ultraviolet Lithography (EUV)
-Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS
-Metrology, Inspection, and Process Control for Microlithography
-Advances in Patterning Materials and Processes
-Optical Microlithography
-Design-Process-Technology Co-optimization for Manufacturability
-Advanced Etch Technology for Nanopatterning

The Advanced Lithography Symposium continues its role in bringing together the microlithography communities involved with semiconductor devices, micro-/nano-systems, and related fields. Participants come from a broad array of backgrounds to share and learn about state-of-the-art design, tools, materials, metrology, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another. The Symposium also provides the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, academics, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.

We welcome your participation for the 2019 SPIE Advanced Lithography Symposium and urge you to submit your abstracts to the appropriate conference as described in the individual Calls for Papers, and be sure to encourage your colleagues to do the same. Relevant topics for new technology groups, keynote talks, or panel discussions are also solicited.

2019 Symposium Chairs

Will Conley

Will Conley
Cymer-An ASML company (USA)
2019 Symposium Chair

Kafai Lai

Kafai Lai
IBM T.J. Watson Research Ctr. (USA)
2019 Symposium Co-Chair



Executive Committee

Ofer Adan, Applied Materials (Israel)
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
Will Conley, Cymer – An ASML company (USA) 
Nelson Felix, IBM Corp. (USA)
Kenneth A. Goldberg, Lawrence Berkeley National Lab. (USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium) 
Jongwook Kye, SAMSUNG Electronics Co., Ltd. (Korea.Republic of)
Catherine B. Labelle, GLOBALFOUNDRIES Inc. (USA)
Kafai Lai, IBM T.J. Watson Research Ctr. (USA)
Soichi Owa, Nikon Corp. (Japan)
Eric M. Panning, Intel Corp. (USA)
Martha I. Sanchez, IBM Research – Almaden (USA)
Daniel P. Sanders, IBM Almadrn Research Ctr. (USA)
Vladimir A. Ukraintsev, QorvoTM (USA)
Richard Wise, Lam Research Corp. (USA)
Chi-Min Yuan, NXP Semiconductors (USA)

Advisory Committee

Robert D. Allen, IBM Research - Almaden (USA)
William H. Arnold, ASML US, Inc. (USA)
Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
Ralph R. Dammel, EMD Performance Materials Corp. (USA)
Donis G. Flagello, Nikon Research Corp. of America (USA)
Harry J. Levinson, GLOBALFOUNDRIES Inc. (USA)
Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, Fractilia, LLC (USA)
Christopher J. Progler, Photronics, Inc. (USA)
Bruce W. Smith, Rochester Institute of Technology (USA)
C. Grant Willson, The Univ. of Texas at Austin (USA)
Anthony Yen, ASML US, LP (USA)

Important Dates

Abstracts 
Late submissions made online considered by the chairs

Author Notification
26 October 2017

Manuscripts Due
31 January 2018


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