The SPIE Advanced Lithography Symposium has been the showcase for the latest advances in lithography and patterning technology for over four decades. The technology landscape keeps evolving to incubate more sophisticated and diversified information and computing technologies. The semiconductor technology sector, now in the More than Moore era, is facing more challenges that require holistic patterning solutions involving a higher level of interactions among process technologies, devices, and system design sectors. The 2022 Symposium will cover the full spectrum of the advances and challenges in state-of-the art lithography and integrated patterning technology through several topical conferences. Advances in the areas of nano- and micro-patterning for semiconductor IC device applications will be presented in sessions covering optical lithography, extreme-UV (EUV) lithography, computational patterning, metrology/inspection, patterning materials, etch/deposition technology, and system-design-technology co-optimization. As novel patterning and non-IC lithography technologies — such as heterogenous wafer packaging, IoT devices including micro-machines and microsensors, AR/VR devices, and FP Displays — have become more widely explored, related topics in these areas are also addressed.
To cope with the changes in the technology landscape and better serve as the premium platform for bringing together the lithography and patterning communities involved with semiconductor devices, micro-/nano-systems, AR/VR devices, displays and related fields, the 2022 symposium is carefully restructured and renamed as the SPIE Advanced Lithography + Patterning (ALP) Symposium to emphasize the importance of these aspects. Specifically, this year's symposium is structured into six conferences from the previous seven conferences. The motivation is to make each conference wavelength-agnostic and specialize on its own functional areas. The major change is the merging of the system and practice modules of the EUV and optical nanolithography conferences for advanced IC applications, while the non-IC applications module is moved to the novel patterning conference; the computational patterning module is merged with design technology co-optimization conference into a new computation-focused conference; and the material module is merged with the patterning material conference. Each of the six new conferences, as shown on the symposium web site, is organized by current practitioners of the art working together with organizing committees of experts in these fields. Joint sessions between the conferences will be aligned with several predefined application tracks: machine learning, stochastic effects, and overlay. This will offer attendees the opportunity to cover important topics common across these interest areas and minimize same topic presentation overlap.
Participants come from a broad array of backgrounds to share and learn about state-of-the-art advances of all aspects of patterning technologies. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another. The Symposium also provides the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, academics, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields. We welcome your participation for the 2022 SPIE Advanced Lithography + Patterning Symposium, urge you to submit your abstracts to the appropriate conference as described in the individual calls for papers, and hope you will encourage your colleagues to do the same. Relevant topics for new technology groups, keynote talks, or panel discussions are also solicited.
University of Hong Kong (USA)2022 Symposium Chair
LAM Research Corp. (USA)2022 Symposium Co-Chair