The SPIE Advanced Lithography + Patterning Symposium has been the showcase of the latest advances in lithography and patterning technology for over four decades. The technology landscape keeps on evolving to incubate more sophisticated and diversified information and computing technologies. The semiconductor technology sector, now in the More-than-Moore era, is facing more challenges that require holistic patterning solutions that involve a higher level of interactions among process technologies, devices, and system design sectors. The 2023 symposium will cover the full spectrum of the advances and challenges in state-of-the art lithography and integrated patterning technology through several topical conferences. Advances in areas of nano- and micro-patterning for semiconductor IC device applications will be presented in sessions covering optical lithography, extreme-UV (EUV) lithography, computational patterning, metrology/inspection, patterning materials, etch/deposition technology, and System-Design-Technology co-optimization. As novel patterning and non-IC lithography technologies, such as heterogenous wafer packaging, IoT devices including micro-machines and microsensors, AR/VR devices, FP Displays, have become more widely explored, related topics in these areas are also addressed.
To cope with the changes in the technology landscape and serve better as the premium platform for bringing together the lithography and patterning communities involved with semiconductor devices, micro-/nano-systems, AR/VR devices, displays, and related fields, the 2023 symposium is carefully structured into six functionally distinct conferences that are organized by current practitioners of the art working together with organizing committees of experts in these fields. Joint sessions between the conferences will be aligned with several predefined Application Tracks: machine learning, stochastic effects, and overlay, which will offer attendees the opportunity to cover important topics common across these interest areas and minimize presentation overlap.
Participants come from a broad array of backgrounds to share and learn about state-of-the-art advances of all aspects of patterning technologies. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another. The Symposium also provides the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, academics, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields. We welcome your participation for the 2023 SPIE Advanced Lithography and Patterning Symposium and urge you to submit your abstracts to the appropriate conference as described in the individual Calls for Papers and encourage your colleagues to do the same. Relevant topics for new technology groups, keynote talks, or panel discussions are also solicited.
The 2023 symposium also recognizes the importance of fostering a new generation of innovative and strongly skilled lithographers and patterning engineers for the development of electronic and photonic devices and systems technology to advance the digital age. We are offering, for the third year, a student grant program to waive students’ registration and subsidize travel expenses for author and non-author students. We also establish a one-on-one student mentor pairing program aiming to connect technology leaders with students to guide the latter in exploring and planning to succeed in this industry. We would like to engage with academia to encourage and equip students to participate in this ever-exciting and rewarding symposium and career.
University of Hong Kong (USA)2023 Symposium Chair
LAM Research Corp. (USA)2023 Symposium Co-Chair