Poster + Paper
31 August 2022 A concept for a deployable normal incidence EUV mirror based on shape memory alloy sheets
Melville P. Ulmer, Jeffrey H. Dugard, Daniel Quispe, Donald B. Buchholz, Steve P. Stagon, Yip-Wah Chung, Jian Cao, Konstantina Kritikos, Nicolas Guerra, Mark T. Stahl, Ron Shiri, Rajan Vaidyanathan
Author Affiliations +
Conference Poster
Abstract
Based on the science case for the SMEX ESCAPE mission, a normal incidence EUV mirror mission would be an interesting follow on. Our provisional SmallSat/CubeSat design has a 1 m diameter primary deployable mirror. The mirror would be coated with multilayers for normal incidence EUV reflectivity. The deployable mirror substrate is a shape memory alloy (SMA). The SMA needs to be over coated with a material that can be polished and then smoothed further. The combination that worked well on an aluminum cylinder is a high phosphorous content electroless nickel (eNiP) super-polished and then coated with carbon nitride (CNx). The multilayers were deposited on the eNiP+CNx stack. We report here our progress toward putting in place the pieces for a proof of concept. We discuss a scale up of previous return to shape on sheets of NiTi and the ray tracing results that demonstrate a sufficient return to shape of 1 micron. Furthermore, corrections post deployment are possible if desired.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Melville P. Ulmer, Jeffrey H. Dugard, Daniel Quispe, Donald B. Buchholz, Steve P. Stagon, Yip-Wah Chung, Jian Cao, Konstantina Kritikos, Nicolas Guerra, Mark T. Stahl, Ron Shiri, and Rajan Vaidyanathan "A concept for a deployable normal incidence EUV mirror based on shape memory alloy sheets", Proc. SPIE 12181, Space Telescopes and Instrumentation 2022: Ultraviolet to Gamma Ray, 1218131 (31 August 2022); https://doi.org/10.1117/12.2630153
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KEYWORDS
Mirrors

Extreme ultraviolet

Shape memory alloys

Polishing

Surface finishing

Multilayers

Plating

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