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Proceedings Paper

Bridging the gaps between mask inspection/review systems and actual wafer printability using computational metrology and inspection (CMI) technologies
Author(s): Linyong Pang; Vikram Tolani; Masaki Satake; Peter Hu; Danping Peng; Tingyang Liu; Dongxue Chen; Bob Gleason; Anthony Vacca
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Paper Abstract

Computational techniques have become increasingly important to improve resolution of optical lithography. Advanced computational lithography technologies, such as inverse lithography (ILT) and source mask optimization (SMO), are needed to print the most challenging layers, such as contact and metal, at the 20nm node and beyond. In order to deploy SMO and ILT into production, improvements and upgrades of mask manufacturing technology are required. These include writing, inspection, defect review, and repair. For example, mask plane inspection detects defect at highest resolution, but does not correlate accurately with scanner images. Aerial plane mask inspection and AIMSTM produce images close to those of a scanner, but except fot the latest AIMS-32TM, it does not have the flexibility needed to capture all the characteristics of free-form illumination. Advanced Computational Inspection and Metrology provides solutions to many of these issues.

Paper Details

Date Published: 8 November 2012
PDF: 15 pages
Proc. SPIE 8522, Photomask Technology 2012, 85220Z (8 November 2012); doi: 10.1117/12.977176
Show Author Affiliations
Linyong Pang, Luminescent Technologies (United States)
Vikram Tolani, Luminescent Technologies (United States)
Masaki Satake, Luminescent Technologies (United States)
Peter Hu, Luminescent Technologies (United States)
Danping Peng, Luminescent Technologies (United States)
Tingyang Liu, Luminescent Technologies (United States)
Dongxue Chen, Luminescent Technologies (United States)
Bob Gleason, Luminescent Technologies (United States)
Anthony Vacca, Luminescent Technologies (United States)

Published in SPIE Proceedings Vol. 8522:
Photomask Technology 2012
Frank E. Abboud; Thomas B. Faure, Editor(s)

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