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Proceedings Paper

Hardware-software-co-design of parallel and distributed systems using a behavioural programming and multi-process model with high-level synthesis
Author(s): Stefan Bosse
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Paper Abstract

A new design methodology for parallel and distributed embedded systems is presented using the behavioural hardware compiler ConPro providing an imperative programming model based on concurrently communicating sequential processes (CSP) with an extensive set of interprocess-communication primitives and guarded atomic actions. The programming language and the compiler-based synthesis process enables the design of constrained power- and resourceaware embedded systems with pure Register-Transfer-Logic (RTL) efficiently mapped to FPGA and ASIC technologies. Concurrency is modelled explicitly on control- and datapath level. Additionally, concurrency on data-path level can be automatically explored and optimized by different schedulers. The CSP programming model can be synthesized to hardware (SoC) and software (C,ML) models and targets. A common source for both hardware and software implementation with identical functional behaviour is used. Processes and objects of the entire design can be distributed on different hardware and software platforms, for example, several FPGA components and software executed on several microprocessors, providing a parallel and distributed system. Intersystem-, interprocess-, and object communication is automatically implemented with serial links, not visible on programming level. The presented design methodology has the benefit of high modularity, freedom of choice of target technologies, and system architecture. Algorithms can be well matched to and distributed on different suitable execution platforms and implementation technologies, using a unique programming model, providing a balance of concurrency and resource complexity. An extended case study of a communication protocol used in high-density sensor-actuator networks should demonstrate and compare the design of a hardware and software target. The communication protocol is suited for high-density intra-and interchip networks.

Paper Details

Date Published: 3 May 2011
PDF: 13 pages
Proc. SPIE 8067, VLSI Circuits and Systems V, 80670G (3 May 2011); doi: 10.1117/12.888122
Show Author Affiliations
Stefan Bosse, Univ. of Bremen (Germany)
ISIS Sensorial Materials Scientific Ctr. (Germany)

Published in SPIE Proceedings Vol. 8067:
VLSI Circuits and Systems V
Teresa Riesgo; Eduardo de la Torre-Arnanz, Editor(s)

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