The European BOOM project aims at the realization of high-capacity photonic routers using the silicon material as the base for functional and cost-effective integration. Here we present the design, fabrication and testing of the first BOOMgeneration of hybrid integrated silicon photonic devices that implement key photonic routing functionalities. Ultra-fast all-optical wavelength converters and micro-ring resonator UDWDM label photodetectors are realized using either 4um SOI rib or SOI nanowire boards. For the realization of these devices, flip-chip compatible non-linear SOAs and evanescent PIN detectors have been designed and fabricated. These active components are integrated on the SOI boards using high precision flip-chip mounting and heterogeneous InP-to-silicon integration techniques. This type of scalable and cost-effective silicon-based component fabrication opens up the possibility for the realization of chip-scale, power efficient, Tb/s capacity photonic routers.

Date Published: 17 May 2010
PDF: 8 pages
Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 771909 (17 May 2010); doi: 10.1117/12.855958

Published in SPIE Proceedings Vol. 7719:
Silicon Photonics and Photonic Integrated Circuits II
Giancarlo Cesare Righini, Editor(s)