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Proceedings Paper

Power efficient data communication modules for optical networks
Author(s): Henning Schröder; Lars Brusberg; Lutz Stobbe; Tolga Tekin
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Paper Abstract

Optical interconnect technology is discussed as a way to more power efficient tele- and data-communication systems. That is well confirmed for long reach optical interconnects but can be gained also from inter and intra system optical interconnects. Besides component and system architecture issues it is assumed that advanced photonic packaging approaches cause power efficiency advantages at multi chip module level. Transparent thin glass substrates are used for high frequency electrical interconnects and integrated optical waveguides for chip to chip optical communication. A generic approach called "glassPack" is discussed and some relevant technologies are presented in more detail.

Paper Details

Date Published: 13 May 2010
PDF: 9 pages
Proc. SPIE 7716, Micro-Optics 2010, 771629 (13 May 2010); doi: 10.1117/12.854282
Show Author Affiliations
Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Lars Brusberg, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Lutz Stobbe, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Tolga Tekin, Technische Univ. Berlin (Germany)

Published in SPIE Proceedings Vol. 7716:
Micro-Optics 2010
Hugo Thienpont; Peter Van Daele; Jürgen Mohr; Hans Zappe, Editor(s)

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