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Proceedings Paper

Plasma characterization of Tetra III chrome etch system
Author(s): Michael Grimbergen; D. G. Nest; Keven Yu; T. Y. Becky Leung; Madhavi Chandrachood; Alan Ouye; Saravjeet Singh; Ibrahim Ibrahim; Ajay Kumar; David Graves
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Paper Abstract

Both Langmuir probe and spatial optical emission spectroscopy (OES) measurements have been used to characterize the TetraTM chrome etch chamber. Langmuir data was measured over a range of process pressures between 1.5mT and 10mT and source powers between 150W and 500W. At 350W, the data show electron and ion densities near 1 x 109 cm-3 for Ar and for Cl2/O2 etch plasmas. Ion density trends with pressure were observed to be opposite for the two plasmas. The effect of the third electrode designed in the chamber was demonstrated to reduce ion density by more than an order of magnitude for Ar plasma and still lower for Cl2/O2 plasma. Electron temperature and plasma potential are also reduced. Radial OES measurements are reported with a new apparatus that yields direct spatial emission data. Spatial scans of infrared emission from atomic Cl were measured under a range of several chamber conditions already measured with the Langmuir probe. The scans showed that the emission uniformity above the mask can be adjusted to a flat profile by selection of the process condition.

Paper Details

Date Published: 6 November 2009
PDF: 7 pages
Proc. SPIE 7488, Photomask Technology 2009, 74880L (6 November 2009); doi: 10.1117/12.833490
Show Author Affiliations
Michael Grimbergen, Applied Materials (United States)
D. G. Nest, Univ. of California, Berkeley (United States)
Keven Yu, Applied Materials (United States)
T. Y. Becky Leung, Applied Materials (United States)
Madhavi Chandrachood, Applied Materials (United States)
Alan Ouye, Applied Materials (United States)
Saravjeet Singh, Applied Materials (United States)
Ibrahim Ibrahim, Applied Materials (United States)
Ajay Kumar, Applied Materials (United States)
David Graves, Univ. of California, Berkeley (United States)

Published in SPIE Proceedings Vol. 7488:
Photomask Technology 2009
Larry S. Zurbrick; M. Warren Montgomery, Editor(s)

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