Share Email Print

Proceedings Paper

Defect printability analysis by lithographic simulation from high resolution mask images
Author(s): George Chen; James N. Wiley; Jen-Shiang Wang; Rafael C. Howell; Shufeng Bai; Yi-Fan Chen; Frank Chen; Yu Cao; Tadahiro Takigawa; Yasuko Saito; Terunobu Kurosawa; Hideo Tsuchiya; Kinya Usuda; Masakazu Tokita; Fumio Ozaki; Nobutaka Kikuiri; Yoshitake Tsuji
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We report the development of Mask-LMC for defect printability evaluation from sub-200nm wavelength mask inspection images. Both transmitted and reflected images are utilized, and both die-to-die and die-to-database inspection modes are supported. The first step of the process is to recover the patterns on the mask from high resolution T and R images by de-convolving inspection optical effects. This step uses a mask reconstruction model, which is based on rigorous Hopkins-modeling of the inspection optics, and is pre-determined before the full mask inspection. After mask reconstruction, wafer scanner optics and wafer resist simulations are performed on the reconstructed mask, with a wafer lithography model. This step leverages Brion's industry-proven, hardware-accelerated LMC (Lithography Manufacturability Check) technology1. Existing litho process models that are in use for Brion's OPC+ and verification products may be used for this simulation. In the final step, special detectors are used to compare simulation results on the reference and defect dice. We have developed detectors for contact CD, contact area, line and space CD, and edge placement errors. The detection results on test and production reticles have been validated with AIMSTM.

Paper Details

Date Published: 23 September 2009
PDF: 10 pages
Proc. SPIE 7488, Photomask Technology 2009, 74880A (23 September 2009); doi: 10.1117/12.831475
Show Author Affiliations
George Chen, Brion Technologies, Inc. (United States)
James N. Wiley, Brion Technologies, Inc. (United States)
Jen-Shiang Wang, Brion Technologies, Inc. (United States)
Rafael C. Howell, Brion Technologies, Inc. (United States)
Shufeng Bai, Brion Technologies, Inc. (United States)
Yi-Fan Chen, Brion Technologies, Inc. (United States)
Frank Chen, Brion Technologies, Inc. (United States)
Yu Cao, Brion Technologies, Inc. (United States)
Tadahiro Takigawa, Brion Technologies KK (Japan)
Yasuko Saito, Brion Technologies KK (Japan)
Terunobu Kurosawa, Brion Technologies KK (Japan)
Hideo Tsuchiya, NuFlare Technology, Inc. (Japan)
Kinya Usuda, NuFlare Technology, Inc. (Japan)
Masakazu Tokita, NuFlare Technology, Inc. (Japan)
Fumio Ozaki, Advanced Mask Inspection Technology Inc. (Japan)
Nobutaka Kikuiri, Advanced Mask Inspection Technology Inc. (Japan)
Yoshitake Tsuji, Advanced Mask Inspection Technology Inc. (Japan)

Published in SPIE Proceedings Vol. 7488:
Photomask Technology 2009
Larry S. Zurbrick; M. Warren Montgomery, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?