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Proceedings Paper

Aerial image based die-to-model inspections of advanced technology masks
Author(s): Jun Kim; Wei-Guo Lei; Joan McCall; Suheil Zaatri; Michael Penn; Rajesh Nagpal; Lev Faivishevsky; Michael Ben-Yishai; Udy Danino; Aviram Tam; Oded Dassa; Vivek Balasubramanian; Tejas H. Shah; Mark Wagner; Shmoolik Mangan
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Paper Abstract

Die-to-Model (D2M) inspection is an innovative approach to running inspection based on a mask design layout data. The D2M concept takes inspection from the traditional domain of mask pattern to the preferred domain of the wafer aerial image. To achieve this, D2M transforms the mask layout database into a resist plane aerial image, which in turn is compared to the aerial image of the mask, captured by the inspection optics. D2M detection algorithms work similarly to an Aerial D2D (die-to-die) inspection, but instead of comparing a die to another die it is compared to the aerial image model. D2M is used whenever D2D inspection is not practical (e.g., single die) or when a validation of mask conformity to design is needed, i.e., for printed pattern fidelity. D2M is of particular importance for inspection of logic single die masks, where no simplifying assumption of pattern periodicity may be done. The application can tailor the sensitivity to meet the needs at different locations, such as device area, scribe lines and periphery. In this paper we present first test results of the D2M mask inspection application at a mask shop. We describe the methodology of using D2M, and review the practical aspects of the D2M mask inspection.

Paper Details

Date Published: 30 September 2009
PDF: 8 pages
Proc. SPIE 7488, Photomask Technology 2009, 748808 (30 September 2009); doi: 10.1117/12.829637
Show Author Affiliations
Jun Kim, Intel Corp. (United States)
Wei-Guo Lei, Intel Corp. (United States)
Joan McCall, Intel Corp. (United States)
Suheil Zaatri, Intel Corp. (United States)
Michael Penn, Intel Corp. (United States)
Rajesh Nagpal, Intel Corp. (United States)
Lev Faivishevsky, Applied Materials, Inc. (Israel)
Michael Ben-Yishai, Applied Materials, Inc. (Israel)
Udy Danino, Applied Materials, Inc. (Israel)
Aviram Tam, Applied Materials, Inc. (Israel)
Oded Dassa, Applied Materials, Inc. (Israel)
Vivek Balasubramanian, Applied Materials, Inc. (Israel)
Tejas H. Shah, Applied Materials, Inc. (Israel)
Mark Wagner, Applied Materials, Inc. (Israel)
Shmoolik Mangan, Applied Materials, Inc. (Israel)

Published in SPIE Proceedings Vol. 7488:
Photomask Technology 2009
Larry S. Zurbrick; M. Warren Montgomery, Editor(s)

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