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Proceedings Paper

Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results
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Paper Abstract

In this paper we give an overview of the fabrication and assembly induced performance degradation of an intra-multi-chip-module free-space optical interconnect, integrating micro-lenses and a deflection prism above a dense opto-electronic chip. The proposed component is used to demonstrate the capabilities of an accurate micro-optical rapid prototype technique, namely the Deep Proton Writing (DPW). To evaluate the accuracy of DPW and to assess whether our assembly scheme will provide us with a reasonable process yield, we have built a simulation framework combining mechanical Monte Carlo analysis with optical simulations. Both the technological requirements to ensure a high process yield, and the specifications of our in-house DPW technology are discussed. Therefore, we first conduct a sensitivity analysis and we subsequently simulate the effect of combined errors using a Monte Carlo simulation. We are able to investigate the effect of a technology accuracy enhancement on the fabrication and assembly yield by scaling the standard deviation of the errors proportionally to each sensitivity interval. We estimate that 40% of the systems fabricated with DPW will show an optical transmission efficiency above -4.32 dB, which is -3 dB below the theoretical obtainable value. We also discuss our efforts to implement an opto-mechanical Monte Carlo simulator. It enables us to address specific issues not directly related with the micro-optical or DPW components, such as the influence of glueing layers and structures that allow for self-alignment, by combining mechanical tolerancing algorithms with optical simulation software. More in particular we determined that DPW provides ample accuracy to meet the requirements to obtain a high manufacturing yield. Finally, we shortly highlight the basic layout of a completed demonstrator. The adhesive bonding of opto-electronic devices in their package is subject to further improvement to enhance the tilt accuracy of the devices with respect to the optical interconnect modules.

Paper Details

Date Published: 21 April 2006
PDF: 13 pages
Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850P (21 April 2006); doi: 10.1117/12.662812
Show Author Affiliations
Michael Vervaeke, Vrije Univ. Brussel (Belgium)
Markku Lahti, VTT Technical Research Ctr. of Finland (Finland)
Mikko Karpinnen, VTT Technical Research Ctr. of Finland (Finland)
Christof Debaes, Vrije Univ. Brussel (Belgium)
Bart Volckaerts, Vrije Univ. Brussel (Belgium)
Pentti Karioja, VTT Technical Research Ctr. of Finland (Finland)
Hugo Thienpont, Vrije Univ. Brussel (Belgium)


Published in SPIE Proceedings Vol. 6185:
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Hugo Thienpont; Mohammad R. Taghizadeh; Peter Van Daele; Jürgen Mohr, Editor(s)

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