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Proceedings Paper

Integration of smart materials into high-volume manufacturing methods
Author(s): Emanuele Bianchini
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Paper Abstract

The integration of smart materials such as piezoelectric devices and shape memory alloys into structures has been typically limited to a bonding process that occurs as a secondary operation. Such an operation is not only costly for high volume applications but also has the potential of degrading the performance of the actuator or sensor due to the bonding agent selected. The work presented here explores the integration of piezoelectric materials using a high volume injection molding process. The process used is typical for large automotive components such as bumpers, instrument panels and other body panels. Different materials were evaluated, including plastics and both bare and packaged smart materials. Temperature and flow rate were also changed to investigate the effects on the durability of the materials. Both electrical and mechanical properties were tested with the key parameters including, void content, shifting from initial position, strain transfer and peal strength. It was found that good integration of piezoelectric materials could be achieved and electro-mechanical properties were improved as compared to a secondary bonding operation. Integration of screen-printed electrical circuits for electrical connectivity for piezoelectric materials will be evaluated in future research. In conclusion, a step forward was made in developing a multifunctional material based upon smart materials and conventional high volume manufacturing processes.

Paper Details

Date Published: 30 March 2006
PDF: 10 pages
Proc. SPIE 6171, Smart Structures and Materials 2006: Industrial and Commercial Applications of Smart Structures Technologies, 61710A (30 March 2006); doi: 10.1117/12.659167
Show Author Affiliations
Emanuele Bianchini, Vibration-X, S.a.s. (Italy)

Published in SPIE Proceedings Vol. 6171:
Smart Structures and Materials 2006: Industrial and Commercial Applications of Smart Structures Technologies
Edward V. White, Editor(s)

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