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Proceedings Paper

Investigation of immersion related defects using pre- and post-wet experiments
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Paper Abstract

To evaluate the effect of water exposure to a resist stack a set of experiments was designed that introduce a pre- and post-exposure wetting time to a coated wafer. The ASML 1150i α-immersion scanner, integrated with a TEL-Lithius coater track, was used to investigate the formation of defects related to the extended wetting. In the first approach, wetting was achieved using a dynamic DI-water rinse in the developer module of the track. For the second approach the immersion hood was positioned over the wafer at a fixed position and time, subjecting the wafer area below the immersion hood to the flowing water. We investigated various resists and topcoats. Defect inspections were performed on these film stacks after imaging.

Paper Details

Date Published: 20 March 2006
PDF: 9 pages
Proc. SPIE 6154, Optical Microlithography XIX, 61540T (20 March 2006); doi: 10.1117/12.656697
Show Author Affiliations
Stefan Brandl, Infineon Technologies North America Corp. (United States)
Robert Watso, ASML (Netherlands)
Bill Pierson, ASML (Netherlands)
Steve Holmes, IBM (United States)
Yayi Wei, Infineon Technologies North America Corp. (United States)
Karen Petrillo, IBM (United States)
Kevin Cummings, ASML (United States)
Frank Goodwin, Infineon Technologies North America Corp. (United States)

Published in SPIE Proceedings Vol. 6154:
Optical Microlithography XIX
Donis G. Flagello, Editor(s)

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