Share Email Print

Proceedings Paper

193-nm immersion photomask image placement in exposure tools
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In case drastic changes need to be made to tool configurations or blank specifications, it is important to know as early as possible under which conditions the tight image placement requirements of future lithography nodes can be achieved. Modeling, such as finite element simulations, can help predict the magnitude of structural and thermal effects before actual manufacturing issues occur, and basic experiments using current tools can readily be conducted to verify the predicted results or perform feasibility tests for future nodes. Using numerical simulations, experimental mask registration, and printing data, the effects on image placement of stressed layer patterning, pellicle attachment, blank dimensional and material tolerances, as well as charging during e-beam writing were investigated for current mask blank specifications. This provides an understanding of the areas that require more work for image placement error budgets to be met and to insure the viability of optical lithography for future nodes.

Paper Details

Date Published: 15 March 2006
PDF: 10 pages
Proc. SPIE 6154, Optical Microlithography XIX, 61541F (15 March 2006); doi: 10.1117/12.656373
Show Author Affiliations
Eric Cotte, Advanced Mask Technology Ctr. (Germany)
Benjamin Alles, TU München (Germany)
Timo Wandel, Advanced Mask Technology Ctr. (Germany)
Gunter Antesberger, Advanced Mask Technology Ctr. (Germany)
Silvio Teuber, Advanced Mask Technology Ctr. (Germany)
Manuel Vorwerk, Infineon Technologies AG (Germany)
Andreas Frangen, Infineon Technologies AG (Germany)
Frank Katzwinkel, Infineon Technologies AG (Germany)

Published in SPIE Proceedings Vol. 6154:
Optical Microlithography XIX
Donis G. Flagello, Editor(s)

© SPIE. Terms of Use
Back to Top