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Proceedings Paper

DFM: a practical layout optimization procedure for the improved process window for an existing 90-nm product
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Paper Abstract

As the advent of advanced process technology such as 90-nm and below, the design rules become more and more complicated than before. These complicated design rules can guarantee process margin for the most layout environments. However, some layouts have narrow process windows that were still within the design rules. For example, line end layouts in a dense environment would generally have narrower process window than that of the onedimensional (1-D) dense line environment. The dense line end spacing design rule would be larger than that of the 1-D dense line spacing to compensate for the narrow window effect. In this work, an optical simulation software was used to examine an existing 90-nm FPGA product pre-OPC layout for its optical contrast. The optical contrast could correlate to the depth of focus (DOF) process window. Several back end locations were identified with possible narrow DOF windows. From the evaluations of these low contrast patterns, several design for manufacturing (DFM) rules and DRC deck was then developed. This deck effectively identified the narrow process window layout locations, previously found with the simulation software. These locations were then optimized for the improved DOF windows. Both simulation and in-line data showed that the DOF window was improved after the layout optimization. Product data with optimized layouts also showed the improved yield.

Paper Details

Date Published: 14 March 2006
PDF: 10 pages
Proc. SPIE 6156, Design and Process Integration for Microelectronic Manufacturing IV, 61560C (14 March 2006); doi: 10.1117/12.656085
Show Author Affiliations
Jonathan Ho, Xilinx Inc. (United States)
Yan Wang, Xilinx Inc. (United States)
Ya-Ching Hou, United Microelectronics Corp. (Taiwan)
Benjamin Szu-Min Lin, United Microelectronics Corp. (Taiwan)
Chun Chi Yu, United Microelectronics Corp. (Taiwan)
Kechih Wu, Anchor Semiconductor, Inc. (United States)
Cliff Ma, KLA-Tencor Inc. (United States)

Published in SPIE Proceedings Vol. 6156:
Design and Process Integration for Microelectronic Manufacturing IV
Alfred K. K. Wong; Vivek K. Singh, Editor(s)

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