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Proceedings Paper

OPC to improve lithographic process window
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Paper Abstract

Optical Proximity Correction (OPC) has become an indispensable tool used in deep sub-wavelength lithographic processes. OPC has been quite successful at reducing the linewidth dispersion across a product die, and also improving the overlapping process window of all printed features. This is achieved solely by biasing the mask features such that all print on target at the same dose. Recent advances in process window modeling, combined with highly customizable simulation and correction engines, have enabled process-aware OPC corrections. Building on these advances, the authors will describe a fast Process Window OPC (PWOPC) technique. This technique results in layouts with reduced sensitivity to defocus variations, less susceptibility to bridging and pinching failures, and greater coverage of over/underlying features (such as contact coverage by metal).

Paper Details

Date Published: 14 March 2006
PDF: 8 pages
Proc. SPIE 6156, Design and Process Integration for Microelectronic Manufacturing IV, 61561I (14 March 2006); doi: 10.1117/12.655237
Show Author Affiliations
James Word, Mentor Graphics Corp. (United States)
Kyohei Sakajiri, Mentor Graphics Corp. (United States)

Published in SPIE Proceedings Vol. 6156:
Design and Process Integration for Microelectronic Manufacturing IV
Alfred K. K. Wong; Vivek K. Singh, Editor(s)

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