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Proceedings Paper

Fabrication of phone-camera module using wafer-scale UV embossing process
Author(s): Dong-Ik Shin; Sung-Kwa Kim; Ho-Seop Jeong; SeokCheon Lee; YoungSu Jin; JungEun Noh; HyeRan Oh; KiUn Lee; Dong Ho Shin; Seok Ho Song
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Paper Abstract

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 230 μm sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

Paper Details

Date Published: 6 February 2006
PDF: 8 pages
Proc. SPIE 6068, Sensors, Cameras, and Systems for Scientific/Industrial Applications VII, 60680Q (6 February 2006); doi: 10.1117/12.643461
Show Author Affiliations
Dong-Ik Shin, Samsung Electro-Mechanics (South Korea)
Sung-Kwa Kim, Samsung Electro-Mechanics (South Korea)
Ho-Seop Jeong, Samsung Electro-Mechanics (South Korea)
SeokCheon Lee, Samsung Electro-Mechanics (South Korea)
YoungSu Jin, Samsung Electro-Mechanics (South Korea)
JungEun Noh, Samsung Electro-Mechanics (South Korea)
HyeRan Oh, Samsung Electro-Mechanics (South Korea)
KiUn Lee, Samsung Electro-Mechanics (South Korea)
Dong Ho Shin, Samsung Electro-Mechanics (South Korea)
Seok Ho Song, Hanyang Univ. (South Korea)

Published in SPIE Proceedings Vol. 6068:
Sensors, Cameras, and Systems for Scientific/Industrial Applications VII
Morley M. Blouke, Editor(s)

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