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Proceedings Paper

Fiber optic polymer residue monitor
Author(s): Kent B. Pfeifer; Robert L. Jarecki; Timothy J. Dalton
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Paper Abstract

Semiconductor processing tools that use a plasma to etch polysilicon or oxides produce residue polymers that build up on the exposed surfaces of the processing chamber. These residues are generally stressed and with time can cause flaking onto wafers resulting in yield loss. Currently, residue buildup is not monitored, and chambers are cleaned at regular intervals resulting in excess downtime for the tool. In addition, knowledge of the residue buildup rate and index of refraction is useful in determining the state of health of the chamber process. We have developed a novel optical fiber-based robust sensor that allows measurement of the residue polymer buildup while not affecting the plasma process.

Paper Details

Date Published: 18 December 1998
PDF: 9 pages
Proc. SPIE 3539, Chemical Microsensors and Applications, (18 December 1998); doi: 10.1117/12.333752
Show Author Affiliations
Kent B. Pfeifer, Sandia National Labs. (United States)
Robert L. Jarecki, Sandia National Labs. (United States)
Timothy J. Dalton, Digital Semiconductor (United States)

Published in SPIE Proceedings Vol. 3539:
Chemical Microsensors and Applications
Stephanus Buettgenbach, Editor(s)

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