Share Email Print
cover

Proceedings Paper • new

A lift-off of pattern structures on the heat-mode resists
Author(s): Zhengwei Wang; Kui Zhang; Guodong Chen; Yang Wang; Jingsong Wei
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Laser heat-mode lithography is very useful for the fabrication of micro/nanostructure-based optical elements. In laser heat-mode lithography, the pattern structures need to be transferred to the substrates by wet-etching or dry-etching method. In this work, a lift-off method for the pattern transfer in laser heat-mode lithography was proposed and studied. A desirable undercut profile was obtained by manipulating the thermal field profile of laser heat-mode exposure, and a lift-off of Cr layer with a thickness of 80 nm on a quartz glass substrate was achieved. The results indicated that laser heat-mode lithography with lift-off process is an effective method to transfer the pattern structures to Cr layer and generate a Cr-based hard mask, which is useful for the fabrication of micro/nanostructure-based optical elements.

Paper Details

Date Published: 8 July 2019
PDF: 6 pages
Proc. SPIE 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019), 110640C (8 July 2019); doi: 10.1117/12.2539074
Show Author Affiliations
Zhengwei Wang, Shanghai Institute of Optics and Fine Mechanics (China)
Univ. of Chinese Academy of Sciences (China)
Kui Zhang, Shanghai Institute of Optics and Fine Mechanics (China)
Univ. of Chinese Academy of Sciences (China)
Guodong Chen, Shanghai Institute of Optics and Fine Mechanics (China)
Univ. of Chinese Academy of Sciences (China)
Yang Wang, Shanghai Institute of Optics and Fine Mechanics (China)
Jingsong Wei, Shanghai Institute of Optics and Fine Mechanics (China)


Published in SPIE Proceedings Vol. 11064:
Tenth International Conference on Thin Film Physics and Applications (TFPA 2019)
Junhao Chu; Jianda Shao, Editor(s)

© SPIE. Terms of Use
Back to Top