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Proceedings Paper

Integrated atomic scale CD control and local variability reduction techniques
Author(s): Toru Hisamatsu; Takayuki Katsunuma; Yoshihide Kihara; Masanobu Honda
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Paper Abstract

In patterning etch processes, the fabrication of multilayer films requires the precision of atomic scale X-Y CD controllability in complex hole patterns, and reduction of local variability such as Line Edge Roughness (LER), Line Width Roughness (LWR) and Local CDU (LCDU). In order to solve these requirements, we have developed Advanced Quasi-ALE technology which achieved reduction of LCDU, along with a wider X-Y CD control margin. In this paper, we introduce the three benefits of our atomic scale CD and variability control process technology; (1) XY CD control in oval patterns, (2) LCDU reduction and (3) wider etching window using Advanced Quasi-ALE technique. Hence, we will show that it has a significant potential to solve critical challenges in the patterning processes of N5 and beyond.

Paper Details

Date Published: 20 March 2019
PDF: 6 pages
Proc. SPIE 10963, Advanced Etch Technology for Nanopatterning VIII, 109630B (20 March 2019); doi: 10.1117/12.2513832
Show Author Affiliations
Toru Hisamatsu, Tokyo Electron Miyagi Ltd. (Japan)
Takayuki Katsunuma, Tokyo Electron Miyagi Ltd. (Japan)
Yoshihide Kihara, Tokyo Electron Miyagi Ltd. (Japan)
Masanobu Honda, Tokyo Electron Miyagi Ltd. (Japan)

Published in SPIE Proceedings Vol. 10963:
Advanced Etch Technology for Nanopatterning VIII
Richard S. Wise; Catherine B. Labelle, Editor(s)

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