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Proceedings Paper

Dynamic image acquisition and verification for a 32-stages time delay and integration CMOS image sensor
Author(s): Po-Yen Huang; Wen-Yu Lo; Yi-Kai Huang; Sheng-Yeh Lai; Jer Ling; Da-Chiang Chang; Ming-Yuan Yeh
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Paper Abstract

For the earth observation mission, there are some critical environmental requirements including low-light condition, fast moving objects, high scanning rate. In order to meet these requirements, the Time-Delay-and-Integration (TDI) technique is critical and essential for the sensor part to improve the Signal to Noise Ratio (SNR) performance. National space organization (NSPO) collaborates with National Chip Implementation Center (CIC) on the next generation image sensor. In order to increase SNR under the light-starved condition, a 32-stages digital-accumulator Time-Delay-and-Integration (TDI) CMOS image sensor is adapted to improve the image quality. Besides, it could successfully take several pictures under different TDI stages on a dynamic test bench. The experimental results verified that the 32-stage TDI CMOS image sensor could function well.

Paper Details

Date Published: 25 September 2018
PDF: 7 pages
Proc. SPIE 10785, Sensors, Systems, and Next-Generation Satellites XXII, 107850Y (25 September 2018); doi: 10.1117/12.2500129
Show Author Affiliations
Po-Yen Huang, National Space Organization (Taiwan)
Wen-Yu Lo, National Chip Implementation Ctr. (Taiwan)
Yi-Kai Huang, National Space Organization (Taiwan)
Sheng-Yeh Lai, National Chip Implementation Ctr. (Taiwan)
Jer Ling, National Space Organization (Taiwan)
Da-Chiang Chang, National Chip Implementation Ctr. (Taiwan)
Ming-Yuan Yeh, National Space Organization (Taiwan)

Published in SPIE Proceedings Vol. 10785:
Sensors, Systems, and Next-Generation Satellites XXII
Steven P. Neeck; Philippe Martimort; Toshiyoshi Kimura, Editor(s)

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