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Proceedings Paper

Wafer warpage characterization measurement with modified fringe reflection method
Author(s): Po-Yi Chang; Yi-Sha Ku
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Paper Abstract

We have demonstrated a modified fringe reflection method to compensate the warpage measurement errors caused by the height difference between optical reference mirror and wafer sample surface. We have used a linearity analysis approach to obtain the parabolic height errors for a 4-inch sapphire wafer warpage measurement, which is around 1.48 μm of 100 μm height difference. The experimental results shows the warp discrepancy of 6-inch sapphire wafer is less than 1 μm compared with the reference Tropel instrument.

Paper Details

Date Published: 22 June 2015
PDF: 5 pages
Proc. SPIE 9525, Optical Measurement Systems for Industrial Inspection IX, 952528 (22 June 2015); doi: 10.1117/12.2184699
Show Author Affiliations
Po-Yi Chang, Industrial Technology Research Institute (Taiwan)
Yi-Sha Ku, Industrial Technology Research Institute (Taiwan)

Published in SPIE Proceedings Vol. 9525:
Optical Measurement Systems for Industrial Inspection IX
Peter Lehmann; Wolfgang Osten; Armando Albertazzi Gonçalves Jr., Editor(s)

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