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Proceedings Paper

Scatterometry-based defect detection for DSA in-line process control
Author(s): Robin Chao; Chi-Chun Liu; Cornel Bozdog; Aron Cepler; Matthew Sendelbach; Oded Cohen; Shay Wolfling; Todd Bailey; Nelson Felix
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Paper Abstract

Successful implementation of directed self-assembly in high volume manufacturing is contingent upon the ability to control the new DSA-specific local defects such as “dislocations” or “line-shifts” or “fingerprint-like” defects. Conventional defect inspection tools are either limited in resolution (brightfield optical methods) or in the area / number of defects to investigate / review (SEM). Here we explore in depth a scatterometry-based technique that can bridge the gap between area throughput and detection resolution. First we establish the detection methodology for scatterometry-based defect detection, then we compare to established methodology. Careful experiments using scatterometry imaging confirm the ultimate resolution for defect detection of scatterometry-based techniques as low as <1% defect per area sampled – similar to CD-SEM based detection, while retaining a 2 orders of magnitude higher area sampling rate.

Paper Details

Date Published: 19 March 2015
PDF: 17 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 942419 (19 March 2015); doi: 10.1117/12.2087093
Show Author Affiliations
Robin Chao, IBM Albany Nanotech (United States)
Chi-Chun Liu, IBM Albany Nanotech (United States)
Cornel Bozdog, Nova Measuring Instruments Ltd. (Israel)
Aron Cepler, Nova Measuring Instruments, Inc. (United States)
Matthew Sendelbach, Nova Measuring Instruments, Inc. (United States)
Oded Cohen, Nova Measuring Instruments Ltd. (Israel)
Shay Wolfling, Nova Measuring Instruments Ltd. (Israel)
Todd Bailey, IBM Semiconductor Research and Development Ctr. (United States)
Nelson Felix, IBM Albany Nanotech (United States)

Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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