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Proceedings Paper

Hybridization of XRF/XPS and scatterometry for Cu CMP process control
Author(s): Benoit L'Herron; Robin Chao; Kwanghoon Kim; Wei Ti Lee; Koichi Motoyama; Bartlet Deprospo; Theodorus Standaert; John Gaudiello; Cindy Goldberg
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Paper Abstract

This paper demonstrates the synergy between X-rays techniques and scatterometry, and the benefits to combine the data to improve the accuracy and precision for in-line metrology. Particular example is given to show that the hybridization addresses the challenges of aggressive patterning. In 10nm node back-end-of-line (BEOL) integration, we show that the hybridized data between scatterometry and simultaneous X-Ray Fluorescence (XRF) and X-ray Photoelectron Spectroscopy (XPS) provided the closest dimensional correlation to TEM results compared to the individual technique and CDSEM.

Paper Details

Date Published: 19 March 2015
PDF: 8 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241M (19 March 2015); doi: 10.1117/12.2086155
Show Author Affiliations
Benoit L'Herron, STMicroelectronics (United States)
Robin Chao, IBM Albany Nanotech (United States)
Kwanghoon Kim, Samsung Electronics Co. (United States)
Wei Ti Lee, ReVera Corp. (United States)
Koichi Motoyama, IBM Albany Nanotech (United States)
Bartlet Deprospo, IBM Albany Nanotech (United States)
Theodorus Standaert, IBM Albany Nanotech (United States)
John Gaudiello, IBM Albany Nanotech (United States)
Cindy Goldberg, STMicroelectronics (United States)


Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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