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Proceedings Paper

High-throughput automatic defect review for 300mm blank wafers with atomic force microscope
Author(s): Ardavan Zandiatashbar; Byong Kim; Young-kook Yoo; Keibock Lee; Ahjin Jo; Ju Suk Lee; Sang-Joon Cho; Sang-il Park
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Paper Abstract

While feature size in lithography process continuously becomes smaller, defect sizes on blank wafers become more comparable to device sizes. Defects with nm-scale characteristic size could be misclassified by automated optical inspection (AOI) and require post-processing for proper classification. Atomic force microscope (AFM) is known to provide high lateral and the highest vertical resolution by mechanical probing among all techniques. However, its low throughput and tip life in addition to the laborious efforts for finding the defects have been the major limitations of this technique. In this paper we introduce automatic defect review (ADR) AFM as a post-inspection metrology tool for defect study and classification for 300 mm blank wafers and to overcome the limitations stated above. The ADR AFM provides high throughput, high resolution, and non-destructive means for obtaining 3D information for nm-scale defect review and classification.

Paper Details

Date Published: 19 March 2015
PDF: 7 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241X (19 March 2015); doi: 10.1117/12.2086042
Show Author Affiliations
Ardavan Zandiatashbar, Park Systems Inc. (United States)
Byong Kim, Park Systems Inc. (United States)
Young-kook Yoo, Park Systems Inc. (United States)
Keibock Lee, Park Systems Inc. (United States)
Ahjin Jo, Park Systems Corp. (Korea, Republic of)
Ju Suk Lee, Park Systems Corp. (Korea, Republic of)
Sang-Joon Cho, Park Systems Corp. (Korea, Republic of)
Sang-il Park, Park Systems Corp. (Korea, Republic of)

Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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