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Proceedings Paper

Overlay measurement accuracy enhancement by design and algorithm
Author(s): Honggoo Lee; Byongseog Lee; Sangjun Han; Myoungsoo Kim; Wontaik Kwon; Sungki Park; DongSub Choi; Dohwa Lee; Sanghuck Jeon; Kangsan Lee; Tal Itzkovich; Nuriel Amir; Roie Volkovich; Eitan Herzel; Mark Wagner; Mohamed El Kodadi
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Paper Abstract

Advanced design nodes require more complex lithography techniques, such as double patterning, as well as advanced materials like hard masks. This poses new challenge for overlay metrology and process control. In this publication several step are taken to face these challenges. Accurate overlay metrology solutions are demonstrated for advanced memory devices.

Paper Details

Date Published: 19 March 2015
PDF: 4 pages
Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94242B (19 March 2015); doi: 10.1117/12.2085272
Show Author Affiliations
Honggoo Lee, SK Hynix, Inc. (Korea, Republic of)
Byongseog Lee, SK Hynix, Inc. (Korea, Republic of)
Sangjun Han, SK Hynix, Inc. (Korea, Republic of)
Myoungsoo Kim, SK Hynix, Inc. (Korea, Republic of)
Wontaik Kwon, SK Hynix, Inc. (Korea, Republic of)
Sungki Park, SK Hynix, Inc. (Korea, Republic of)
DongSub Choi, KLA-Tencor Korea (Korea, Republic of)
Dohwa Lee, KLA-Tencor Korea (Korea, Republic of)
Sanghuck Jeon, KLA-Tencor Korea (Korea, Republic of)
Kangsan Lee, KLA-Tencor Korea (Korea, Republic of)
Tal Itzkovich, KLA-Tencor Israel (Israel)
Nuriel Amir, KLA-Tencor Israel (Israel)
Roie Volkovich, KLA-Tencor Israel (Israel)
Eitan Herzel, KLA-Tencor Israel (Israel)
Mark Wagner, KLA-Tencor Israel (Israel)
Mohamed El Kodadi, KLA-Tencor France (France)


Published in SPIE Proceedings Vol. 9424:
Metrology, Inspection, and Process Control for Microlithography XXIX
Jason P. Cain; Martha I. Sanchez, Editor(s)

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