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Proceedings Paper

Crack detection using induction thermography during high-temperature testing
Author(s): M. Genest; D. C. Dudzinski; L. Dawag; R. K. Kersey
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Paper Abstract

Thermo-mechanical fatigue (TMF) tests and strain to crack (SC) tests at elevated temperature are important aspects to the total fatigue life for many engineering applications. During a TMF test, crack inspections are commonly done in a disruptive manner using an acetate replication method; and post-test crack evaluations are done using both optical and scanning electronic microscopy methods. Similarly, inspections during a typical SC test are also performed in a disruptive manner. This paper demonstrates that infrared imaging can be used as an in-situ inspection approach to detect crack during TMF and SC tests at high temperature. It is also demonstrated that this technique allows for the reduction or elimination of the need for downtime that is typically required for disruptive inspection. The results obtained by induction thermography are compared to those obtained via traditional methods and post-test evaluation. The induction thermography inspections were carried out at several temperatures and showed that the temperature used during the test does not influence the crack detection capability. It is demonstrated that induction thermography can detect cracks smaller than 500 μm and has potential for monitoring and generating a crack growth curve.

Paper Details

Date Published: 22 May 2013
PDF: 6 pages
Proc. SPIE 8705, Thermosense: Thermal Infrared Applications XXXV, 87050P (22 May 2013); doi: 10.1117/12.2015488
Show Author Affiliations
M. Genest, National Research Council Canada (Canada)
D. C. Dudzinski, National Research Council Canada (Canada)
L. Dawag, Pratt & Whitney (United States)
R. K. Kersey, Pratt & Whitney (United States)


Published in SPIE Proceedings Vol. 8705:
Thermosense: Thermal Infrared Applications XXXV
Gregory R. Stockton; Fred P. Colbert, Editor(s)

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