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21 - 25 September 2020
Conference 11517
International Conference on Extreme Ultraviolet Lithography 2020
Conference Committee
Tuesday 20 October Show All Abstracts
Opening Remarks
Session LIVE: Plenary Session: Joint session with conferences 11517 and 11518
Holistic lithography in the age of the Artificial Intelligence of Things (Plenary Presentation) Presentation
Paper 11517-400
Monday 21 September 2020 • 8:30 AM - 9:15 AM PDTLIVE EVENT Author(s): Martin van den Brink, ASML Netherlands B.V. (Netherlands)
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Session LIVE: Keynote Session: Joint Session with conferences 11517 and 11518
0.33 NA EUV systems for High Volume Manufacturing (Keynote Presentation) Presentation
Paper 11517-1
Tuesday 22 September 2020 • 8:30 AM - 9:30 AM PDTLIVE EVENT Author(s): Eric Verhoeven, Ron Schuurhuis, Marcel Mastenbroek, Peter Jonkers, Frank Bornebroek, Arthur Minnaert, Harrie van Dijck, Parham Yaghoobi, ASML Netherlands B.V. (Netherlands); Geert Fisser, ASML Netherlands B.V. (United States); Payam Tayebati, Martijn Leenders, ASML San Diego (United States); Roderik van Es, ASML Netherlands B.V. (Netherlands)
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Session LIVE: Networking & Discussion Session for 11517

Times for this live event are all Pacific Time (UTC-8:00 hours)


Meet colleagues interested in this conference topic for small group discussion and networking, hosted by conference chairs Patrick Naulleau from Lawrence Berkeley National Lab. This informal session emphasizes conversation and connection rather than talk delivery.
Networking & Discussion Session for 11517
Paper 11517-501
Thursday 24 September 2020 • 8:00 AM - 9:00 AM PDTLIVE EVENT Author(s):
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Session LIVE: Live Student Networking & Discussion Session

Times for this live event are all Pacific Time (UTC-8:00 hours)

Join students and industry leaders for a live, facilitated networking discussion. Make new connections and learn by discussing relevant topics in small breakout groups.

https://live.remo.co/e/live-student-networking-and-disc

What to expect: All participants will collect for a brief introduction, and then be assigned to discuss one of the topics in a small group (~four people) for 15-20 minutes. All will return to the large meeting and one student from each group will articulate a key “take-away”. This will be repeated with a second set of small groups.

Topics to select:

1. Work cultures “There are unique work cultures across companies depending on company size, age, service, location, leadership, etc. How do I identify the work culture? Then, how do I successfully integrate into a new work culture?”
2. Individual work styles “My co-workers have different approaches to working than I do. Some are analytical, some are detail-oriented, some are expressive, some are integrative. Is this type of diversity in the workplace important?”
3. Communication at work “My VP seems impatient when I share all the details of the project. How do I effectively communicate the main points of work that spans months (or years)? What if I prepared a detailed report, but the target audience has five minutes to listen to me?”
4. Success in the corporate world "What do you mean, we don't publish a paper on this work? How do we define our success in the corporate world?"
5. Time management "The project ends next month, and I'm not close to done yet! How do I manage my time and competing demands to earn my paycheck?"

Session 3: EUV Mask I: Joint Session with conferences 11517 and 11518
EUV phase shift mask requirements for imaging at low-k1 (Invited Paper) Presentation
Paper 11518-1
Author(s): Frank J. Timmermans, Claire van Lare, Jo Finders, Robert de Kruif, ASML Netherlands B.V. (Netherlands)
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Mask absorber for next generation EUV lithography (Invited Paper) Paper Presentation
Paper 11517-2
Author(s): Meiyi Wu, Devesh Thakare, imec (Belgium), KU Leuven (Belgium); Jean-François de Marneffe, Patrick Jaenen, Laurent Souriau, Karl Opsomer, Jean-Philippe Soulié, imec (Belgium); Andreas Erdmann, Hazem Mesilhy, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany); Philipp Naujok, optiX fab GmbH (Germany); Markus Foltin, SUSS MicroTec Photomask Equipment GmbH & Co. KG (Germany); Victor Soltwisch, Qais Saadeh, Physikalisch-Technische Bundesanstalt (Germany); Vicky Philipsen, imec (Belgium)
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Picometer sensitivity metrology for EUV absorber phase Presentation
Paper 11517-3
Author(s): Stuart Sherwin, Univ. of California, Berkeley (United States); Isvar Cordova, Ryan Miyakawa, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States); Laura Waller, Andrew Neureuther, Univ. of California, Berkeley (United States); Patrick Naulleau, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States)
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Process optimization for performance improvement in Mo/Si multilayers for EUV mask blanks Paper Presentation
Paper 11517-5
Author(s): Katrina Rook, Paul Turner, Narasimhan Srinivasan, Tania Henry, Veeco Instruments Inc. (United States); Kenji Yamamoto, Veeco Instruments Inc. (Japan); Meng Lee, Veeco Instruments Inc. (United States)
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Session 4: EUV Mask Protection and Repair: Joint Session with conferences 11517 and 11518
Ultra-low density, nanostructured free-standing films for EUV Pellicles (Invited Paper) Presentation
Paper 11517-6
Author(s): Márcio D. Lima, Takahiro Ueda, Chi Huynh, Lintec of America, Inc. (United States); Tetsuo Harada, Univ. of Hyogo (Japan); Takeshi Kondo, Lintec of America, Inc. (United States)
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Mo Silicide EUV pellicle Presentation
Paper 11517-7
Author(s): Ha Neul Kim, Yong Ju Jang, Seong Ju Wi, Chang Soo Kim, Jinho Ahn, Hanyang Univ. (Korea, Republic of)
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In-situ and real-time investigation of EUV pellicle mechanical stress within EUV inner pod Paper Presentation
Paper 11517-8
Author(s): Ching-Te Kuo, National Sun Yat-sen Univ. (Taiwan); Claire Lee, J. S. Wu, Chia-Ho Chuang, Bill Chiu, Gudeng Precision Industrial Co., Ltd. (Taiwan)
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High-end EUV photomask repairs for 5nm technology and beyond Paper Presentation
Paper 11518-2
Author(s): Horst Schneider, Fan Tu, Laura Ahmels, Bartholomaeus Szafranek, Katharina Gries, Daniel Rhinow, Sebastian Vollmar, Andreas Krugmann, Ralf Schoenberger, Walter Pauls, Andreas Verch, Renzo Capelli, Alice D. Vincenzo, Grizelda Kersteen, Hubertus Marbach, Michael Waldow, Carl Zeiss SMT GmbH (Germany)
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Laser repair and clean of extreme ultraviolet lithography photomasks Paper Presentation
Paper 11518-3
Author(s): Tod E. Robinson, Jeff LeClaire, Bruker BNSM RMR (United States); Iacopo Mochi, Ricarda Maria Nebling, Yasin Ekinci, Dimitrios Kazazis, Paul Scherrer Institut (Switzerland)
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Session 5: EUV Resist
Dissolution nonlinearity tail degradation with decreased reaction events impacts EUV stochastic defect generations Paper Presentation
Paper 11517-9
Author(s): Hiroshi Fukuda, Hitachi High-Tech Corp. (Japan)
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A novel main chain scission type photoresists for EUV lithography Paper Presentation
Paper 11517-10
Author(s): Akihide Shirotori, Manabu Hoshino, Zeon Corp. (Japan); Danilo De Simone, Geert Vandenberghe, imec (Belgium); Hirokazu Matsumoto, Zeon Corp. (Japan)
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High sensitivity non-CAR type hemicellulose resists for EUV Lithography Presentation
Paper 11517-11
Author(s): Kazuyo Morita, Kimiko Yamamoto, Yasuaki Tanaka, Hiroki Tanaka, Oji Holdings Corp. (Japan); Masahiko Harumoto, Yuji Tanaka, Chisayo Mori, You Arisawa, Tomohiro Motono, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Harold Stokes, SCREEN SPE Germany GmbH (Germany); Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
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How to improve 'Chemical Stochastic' in EUV lithography Presentation
Paper 11517-12
Author(s): Toru Fujimori, FUJIFILM Corp. (Japan)
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Study on dependence of transient swelling layer formation on molecular weight and dispersion of backbone polymer of chemically amplified EUV resists Presentation
Paper 11517-13
Author(s): Takahiro Kozawa, Kyoko Watanabe, Kyoko Matsuoka, Naoki Tanaka, Kazuki Azumagawa, Osaka Univ. (Japan); Takuya Ikeda, Yoshitaka Komuro, Daisuke Kawana, Tokyo Ohka Kogyo Co., Ltd. (Japan)
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Engineering resist-substrate interface: a quantum chemistry study of self-assembled monolayers Presentation
Paper 11517-14
Author(s): Jonathan H. Ma, Univ. of California, Berkeley (United States), The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States); Isvar A. Cordova, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States); Rudy Wojtecki, IBM Research - Almaden (United States); Andrew Neureuther, Univ. of California, Berkeley (United States); Patrick P. Naulleau, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States)
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Session 6: Resist Metrology
Non-destructive depth profile characterization of EUV nanoscale photoresist films by standing-wave photoemission spectroscopy Presentation
Paper 11517-15
Author(s): Henrique Perin Martins, Isvar A. Cordova, Patrick P. Naulleau, Giuseppina Conti, Slavomir Nemsak, Lawrence Berkeley National Lab. (United States)
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Image blur investigation using EUV-Interference Lithography Presentation
Paper 11517-16
Author(s): Timothée Allenet, Paul Scherrer Institut (Switzerland); Jara G. Santaclara, Gijsbert Rispens, ASML Netherlands B.V. (Netherlands); Bernd Geh, ASML (United States), Carl Zeiss SMT GmbH (Germany); Yasin Ekinci, Paul Scherrer Institut (Switzerland)
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Characterizing Variation in EUV Contact Hole Lithography Presentation
Paper 11517-17
Author(s): Chris A. Mack, Fractilia, LLC (United States); Gian Lorusso, Danilo De Simone, Joren Severi, imec (Belgium)
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Image denoising for electron beam metrology Presentation
Paper 11517-18
Author(s): Luke T. Long, Andrew R. Neureuther, Univ. of California, Berkeley (United States); Patrick Naulleau, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States)
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Panel Session
Session 7: EUV Process
Improvement of EUV processes for high volume manufacturing (Invited Paper) Presentation
Paper 11517-19
Author(s): Makoto Muramatsu, Hiroki Tadatomo, Tomoya Onitsuka, Keisuke Yoshida, Arnaud Dauendorffer, Takahiro Shiozawa, Soichiro Okada, Shinichiro Kawakami, Satoru Shimura, Tokyo Electron Kyushu Ltd. (Japan)
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Influence and control of CD on defectivity for EUV Pitch 32 Line-Space Presentation
Paper 11517-20
Author(s): Christophe Béral, Anne-Laure Charley, Philippe Leray, Frederic Lazzarino, Romuald Blanc, Poulomi Das, Ataklti Weldeslassie, Amir-Hossein Tamaddon, Werner Gillijns, imec (Belgium)
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Accurate mapping of dose variations on EUV scanners using dose-to-clear exposures and optical ellipsometry Paper Presentation
Paper 11517-21
Author(s): Vineet Vijayakrishnan Nair, Lieve van Look, Remko Aubert, Eric Hendrickx, imec (Belgium)
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Fundamental understanding and experimental verification of bright versus dark field imaging Presentation
Paper 11517-22
Author(s): Natalia V. Davydova, Jo Finders, ASML Netherlands B.V. (Netherlands); Joern-Holger Franke, Andreas Frommhold, imec (Belgium); Renzo Capelli, Grizelda Kersteen, Andreas Verch, Carl Zeiss SMT GmbH (Germany); John McNamara, Claire van Lare, Eelco van Setten, Joseph Zekry, Timon Fliervoet, Rene Carpaij, ASML Netherlands B.V. (Netherlands)
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Session 8: EUV Source and Support Tools
Update of >300W high power LPP-EUV source challenge for semiconductor HVM (Invited Paper) Presentation
Paper 11517-23
Author(s): Hakaru Mizoguchi, Hiroaki Nakarai, Tamotsu Abe, Hiroshi Tanaka, Yukio Watanabe, Tsukasa Hori, Yutaka Shiraishi, Yoshifumi Ueno, Tatsuya Yanagida, Georg Soumagne, Tsuyoshi Yamada, Takashi Saitou, Hirokazu Hosoda, Hiroaki Tomuro, Shinji Nagai, Gouta Niimi, Takashi Suganuma, Gigaphoton Inc. (Japan)
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Achievement of an important milestone to realize the EUV-FEL high power light source for future lithograph (Invited Paper) Presentation
Paper 11517-24
Author(s): Ryukou Kato, Hiroshi Sakai, Kimichika Tsuchiya, Yasunori Tanimoto, Yosuke Honda, Tsukasa Miyajima, Miho Shimada, Norio Nakamura, Hiroshi Kawata, High Energy Accelerator Research Organization, KEK (Japan)
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Accuracy analysis of a stand-alone EUV spectrometer for the characterization of ultrathin films and nanoscale gratings Paper Presentation
Paper 11517-25
Author(s): Sophia Schroeder, Lukas Bahrenberg, Nimet Kutay Eryilmaz, Sven Glabisch, RWTH Aachen Univ. (Germany); Serhiy Danylyuk, Fraunhofer-Institut für Lasertechnik ILT (Germany); Sascha Brose, Jochen Stollenwerk, Peter Loosen, RWTH Aachen Univ. (Germany)
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Metrology and irradiation systems for accelerated testing of EUVL components Presentation
Paper 11517-26
Author(s): Jochen Vieker, Klaus Bergmann, Serhiy Danylyuk, Fraunhofer-Institut für Lasertechnik ILT (Germany); Sascha Brose, RWTH Aachen Univ. (Germany)
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Session 9: EUV Mask Inspection Review: Joint Session with conferences 11517 and 11518
High sensitivity repeater detection with broadband plasma optical wafer inspection for mask defect qualification (Invited Paper) Paper Presentation
Paper 11517-27
Author(s): Andrew J. Cross, KLA England (United Kingdom); Kaushik Sah, KLA Corp. (Belgium); Vidyasagar Anantha, Balarka Gupta, Ramon Ynzunza, Neil Troy, Kenong Wu, Raghav Babulnath, Meghna Rajendran, KLA Corp. (United States); Dieter Van den Heuvel, Philippe Leray, imec (Belgium)
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High resolution and uniform image reconstruction in a large field-of-view for EUV actinic mask review Paper Presentation
Paper 11518-27
Author(s): Hyun-Su Kim, Uldis Locans, Ricarda Maria Nebling, Atoosa Dejkameh, Dimitrios Kazazis, Yasin Ekinci, Iacopo Mochi, Paul Scherrer Institut (Switzerland)
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Effects of the illumination NA on EUV mask inspection with coherent diffraction imaging Paper Presentation
Paper 11517-30
Author(s): Ricarda Nebling, Hyun-Su Kim, Uldis Locans, Atoosa Dejkameh, Yasin Ekinci, Iacopo Mochi, Paul Scherrer Institut (Switzerland)
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Quadriwave lateral shearing phase imaging of EUV masks Paper Presentation
Paper 11517-31
Author(s): Wenhua Zhu, Ryan Miyakawa, Patrick Naulleau, Lawrence Berkeley National Lab. (United States)
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Session 10: EUV Mask II: Joint Session with conferences 11517 and 11518
Multilayer optimization for high-NA EUV mask3D suppression Presentation
Paper 11517-32
Author(s): Eelco van Setten, ASML Netherlands B.V. (Netherlands); Katrina Rook, Veeco Instruments Inc. (United States); Hazem Mesilhy, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany); Frank Timmermans, Gerardo Bottiglieri, ASML Netherlands B.V. (Netherlands); Meng Lee, Veeco Instruments Inc. (United States); Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany); Tim Brunner, ASML Wilton (United States)
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Study of EUV reticle storage effects through exposure on EBL2 and NXE Presentation
Paper 11517-28
Author(s): Rik Jonckheere, Vineet Vijayakrishnan Nair, Eric Hendrickx, Remko Aubert, imec (Belgium); Chien-Ching Wu, Veronique de Rooij-Lohmann, Dorus Elstgeest, Henk Lensen, TNO (Netherlands); Victor Soltwisch, Philipp Hoenicke, Michael Kolbe, Frank Scholze, Physikalisch-Technische Bundesanstalt (Germany)
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Stochastic side-lobe printing in EUV lithography: a simulation study Paper Presentation
Paper 11518-28
Author(s): Anatoly Burov, KLA Texas (United States); Alessandro Vaglio Pret, KLA Italy Srl (Italy); Stewart A. Robertson, Patrick B. Lee, KLA Texas (United States)
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Stochastic printing behavior of non-local mask deficiencies in EUV lithography Presentation
Paper 11517-33
Author(s): Rik Jonckheere, imec (Belgium); Lawrence S. Melvin, Synopsys, Inc. (United States)
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Refinement strategies for optimal inclusion of prior information in ptychography Paper Presentation
Paper 11517-34
Author(s): Paolo Ansuinelli, Technische Univ. Delft (Netherlands); Wim M. J. Coene, ASML Netherlands B.V. (Netherlands), Technische Univ. Delft (Netherlands); Hendrik P. Urbach, Technische Univ. Delft (Netherlands)
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Session 11: EUV High NA and Extensions
High-NA EUV Lithography exposure tool: advantages and program progress (Invited Paper) Presentation
Paper 11517-35
Author(s): Jan Van Schoot, Sjoerd Lok, Eelco van Setten, Ruben Maas, Kars Troost, Rudy Peeters, Jo Finders, Judon Stoeldraijer, Jos Benschop, ASML Netherlands B.V. (Netherlands); Paul Graeupner, Peter Kuerz, Winfried Kaiser, Carl Zeiss SMT GmbH (Germany)
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Stitching enablement for anamorphic imaging: an ~1µm exclusion band and its implications Presentation
Paper 11517-36
Author(s): Vincent Wiaux, Joost Bekaert, Tatiana Kovalevich, Eric Hendrickx, imec (Belgium); Natalia V. Davydova, Pieter Woltgens, Ming-Chun Tien, Laurens de Winter, Mark Maslow, Kars Troost, ASML Netherlands B.V. (Netherlands)
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Experimental verification of high-NA imaging simulations using SHARP Paper Presentation
Paper 11517-37
Author(s): Natalia V. Davydova, Fei Liu, ASML Netherlands B.V. (Netherlands); Markus Benk, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States); Eelco van Setten, Gerardo Bottiglieri, Anton van Oosten, John McNamara, ASML Netherlands B.V. (Netherlands); Vincent Wiaux, Joern-Holger Franke, imec (Belgium); Kenneth Goldberg, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States); Dong-Seok Nam, Joseph Zekry, ASML Netherlands B.V. (Netherlands); Patrick Naulleau, The Ctr. for X-Ray Optics, Lawrence Berkeley National Lab. (United States); Timon Fliervoet, Rene Carpaij, ASML Netherlands B.V. (Netherlands)
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High NA EUV scanner: obscuration and wave front description Presentation
Paper 11517-38
Author(s): Laurens de Winter, Jan van Schoot, Timur Tudorovskiy, Kars Troost, Erwin Stinstra, ASML Netherlands B.V. (Netherlands); Stephen Hsu, ASML Silicon Valley (United States); Toralf Gruner, Juergen Mueller, Ruediger Mack, Bartosz Bilski, Joerg Zimmermann, Paul Graeupner, Carl Zeiss SMT GmbH (Germany)
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Tomorrow’s pitches on today’s 0.33 NA scanner: pupil and imaging conditions to print P24 L/S and P28 contact holes Presentation
Paper 11517-39
Author(s): Joern-Holger Franke, imec (Belgium); Natalia V. Davydova, ASML Netherlands B.V. (Netherlands); Joost Bekaert, Vincent Wiaux, Vineet Vijayakrishnan Nair, imec (Belgium); Andre van Dijk, Ziyang Wang, Mark Maslow, ASML Netherlands B.V. (Netherlands); Eric Hendrickx, imec (Belgium)
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Poster Session
Development progress update of the high power LPP-EUV light source using a magnetic field Poster Presentation
Paper 11517-43
Author(s): Takahiro Tatsumi, Yoshifumi Ueno, Takayuki Yabu, Georg Soumagne, Shinji Nagai, Tatsuya Yanagida, Yutaka Shiraishi, Kenichi Miyao, Hideyuki Hayashi, Yukio Watanabe, Tamotsu Abe, Hiroaki Nakarai, Hakaru Mizoguchi, Gigaphoton Inc. (Japan)
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Alternative EUVL resist processes for stochastic defect reduction Paper Poster Presentation
Paper 11517-44
Author(s): Julius Joseph S. Santillan, Osaka Univ. (Japan); Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Harold Stokes, SCREEN SPE Germany GmbH (Germany); Chisayo Mori, Yuji Tanaka, Tomohiro Motono, Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Toshiro Itani, Osaka Univ. (Japan)
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Development of extreme ultraviolet light sources and techniques for optical power meter calibration Paper Poster
Paper 11517-45
Author(s): Wei Jo Ting, Yi-Chen Chuang, Cheng-Hsien Chen, Industrial Technology Research Institute (Taiwan); Ming-Saing Tsai, Ming-Chang Chen, National Tsing Hua Univ. (Taiwan)
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Analysis and mitigation of forbidden pitch effects for EUV lithography Paper Poster
Paper 11517-48
Author(s): Ling Ma, Univ. of Chinese Academy of Sciences (China); Lisong Dong, Taian Fan, Xiaojing Su, Jianfang He, Ruixuan Wu, Institute of Microelectronics, Chinese Academy of Sciences (China); Yumei Zhou, Institute of Microelectronics of Chinese Academy of Sciences, P. R. China (China); Yayi Wei, Institute of Microelectronics, Chinese Academy of Sciences (China)
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Thermal deformation of EUV mask according to mask type and pattern density Poster
Paper 11517-49
Author(s): Chung-Hyun Ban, In-Hwa Kang, Beom-Jun Jeon, Wonyoung Choi, Hye-Keun Oh, Hanyang Univ. (Korea, Republic of)
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Mask contribution to OPC model accuracy Paper Poster
Paper 11517-51
Author(s): Adam Lyons, ASML US, Inc. (United States); Tom Wallow, Christoph Hennerkes, Chris Spence, ASML Silicon Valley (United States); Maxence Delorme, David Rio, ASML Leuven (Belgium), imec (Belgium); Dai Tsunoda, Yohei Torigoe, Masakazu Hamaji, Nippon Control System Corp. (Japan)
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Study on the multi layers for EUV pellicle Paper Poster Presentation
Paper 11517-52
Author(s): Sangjin Cho, Kyoungwon Seo, Kyoungsoo Kim, Lan Yu, Seong-Yong Moon, Fine Semitech Co., Ltd. (Korea, Republic of)
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Design and realization of an industrial stand-alone EUV resist qualification setup Paper Poster
Paper 11517-53
Author(s): Bernhard Lüttgenau, Sascha Brose, Seonghyeok Choi, Dieter Panitzek, RWTH Aachen Univ. (Germany), JARA - Fundamentals of Future Information Technology (Germany); Serhiy Danylyuk, Fraunhofer-Institut für Lasertechnik ILT (Germany); Rainer Lebert, RI Research Instruments GmbH (Germany); Jochen Stollenwerk, Peter Loosen, RWTH Aachen Univ. (Germany), JARA - Fundamentals of Future Information Technology (Germany), Fraunhofer-Institut für Lasertechnik ILT (Germany)
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Conference Committee
Conference Chairs
Program Committee
Program Committee continued...
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