Many ways to shrink: The right moves to 10 nanometer and beyond Martin van den Brink, President and CTO, ASML
With mobile devices such as smartphones outpacing other market segments, the demand for low-power chips, enabled by continued device shrink, continues to be strong. The semiconductor industry’s drive to innovate is relentless, R&D pipelines are filled, and IC manufacturers have multiple options to continue scaling. This presentation will examine the different technology options for the 10 nanometer node and beyond.
More than 70 presentations in these areas
Mask Making: Mask data preparation • Substrates and materials • Patterning tools and processes • Resist and resist processing • Etch techniques • Metrology • Inspection • Repair • Cleaning, contamination, and haze • Simulation of mask making
9-inch Glass: Impact of 450mm wafers on reticle and infrastructure • Tool developments to support larger blanks • Material developments
Mask Business: Mask manufacturing control • Mask shop management • Mask management in wafer fabs • Business aspects of masks • Infrastructure challenges
Co-located with SPIE Scanning Microscopies 2014
New in 2014 - SPIE Photomask Technology was co-located with SPIE Scanning Microscopies 2014, a multidisciplinary conference for advancing scanning microscopy technologies and applications. Two conferences for one registration, plus access to multidisciplinary connections and information.
SPIE Scanning Microscopies Monterey Conference Center and Monterey Marriott Monterey, California, United States 16 - 18 September 2014
