Strasbourg Convention & Exhibition Centre
Strasbourg, France
22 - 26 April 2018
Conference EPE116
Silicon Photonics: from Fundamental Research to Manufacturing
Important
Dates
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Abstract Due:
25 October 2017
Submission website is open. Late submissions will be considered

Author Notification:
26 January 2018

Manuscript Due Date:
26 March 2018

Conference
Committee
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Conference Chairs
  • Roel G. Baets, Univ. Gent (Belgium)
  • Peter O'Brien, Tyndall National Institute (Ireland)
  • Laurent Vivien, Ctr. de Nanosciences et de Nanotechnologies (France)

Program Committee
Program Committee continued...
  • Stefano Pelli, Istituto di Fisica Applicata "Nello Carrara" (Italy)
  • Andrew W. Poon, Hong Kong Univ. of Science and Technology (Hong Kong, China)
  • Joyce K. Poon, Univ. of Toronto (Canada)
  • Miloš A. Popović, Boston Univ. (United States)
  • Stefan F. Preble, Rochester Institute of Technology (United States)
  • Jeremy Witzens, RWTH Aachen Univ. (Germany)
  • Dan-Xia Xu, National Research Council Canada (Canada)
  • Koji Yamada, National Institute of Advanced Industrial Science and Technology (Japan)
  • Zhiping Zhou, Peking Univ. (China)

Call for
Papers
These are exciting times for silicon photonics. The industrial supply chain is being established rapidly, from PIC design tools to PIC manufacturing, through to test and packaging. This enables companies across the world to develop competitive products based on silicon photonics. The market is mostly geared towards telecom and datacom transceivers, but other applications are starting to emerge, including the biomedical and sensor domains.

In addition, new opportunities for research with a longer time-frame are emerging. While the standard SOI-based pilot lines and foundries are capable of delivering telecom wavelength functionalities with a combination of passives, high speed modulators and high speed detectors up to a symbol rate of about 50 Gbaud, there is an interest in and demand for a wide variety of functionalities beyond the capabilities of the established platforms. The list is long but it encompasses amongst others the following challenges:

  • modulation speeds far beyond 50 GBaud
  • integration of light sources in the silicon photonics chips either through heterogeneous approaches such as bonding or transfer printing or through epitaxial approaches
  • migration to both shorter (down to visible and even UV) and longer (up to mid-IR and even THz) wavelength ranges, thereby exploring new CMOS-fab compatible materials and processes, with silicon nitride based PICs being a prominent example
  • significant reduction of footprint and power consumption of various on-chip functionalities
  • entirely novel materials introduced into the silicon eco-system
  • groundbreaking physics taking advantage of the nano-scale maturity of silicon technology
  • extreme requirements of performance in relation to environmental conditions, such as temperature range, exposure to fluids, including body fluids, high optical power etc.
  • new packaging approaches, in particular those with the potential of significant cost reduction
  • new circuit-level approaches, in particular with a view of programmable or fault-tolerant system behavior or quantum functionalities
  • novel device concepts.

  • Original theoretical and experimental contributions are solicited from the international academic and industrial silicon photonics community on these subjects. The conference aims to confront established mature approaches with novel research achievements, creating an environment of discussion about the future roadmap of silicon photonics: which novel approaches should be included in standardized platforms and when?
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