Strasbourg Convention & Exhibition Centre
Strasbourg, France
22 - 26 April 2018
Conference EPE108
Optical Micro- and Nanometrology
Important
Dates
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Abstract Due:
25 October 2017
Submission website is open. Late submissions will be considered

Author Notification:
26 January 2018

Manuscript Due Date:
26 March 2018

Conference
Committee
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Conference Chairs
Program Committee
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Papers

Microsystems and particularly MEMS or MOEMS ask integration of heterogeneous technologies including micromechanical components, optics, electronics, sensors and actuators. Since wafer stack of ICs and discrete electronic components are being assembled in the same package with MEMS/MOEMS, microoptical systems and/or other photonic or optoelectronic devices, there is a need of new measurement techniques for characterization and testing, operating during the chip-production and for lifetime cycle prediction. Fortunately, optical inspection systems provide an ideal way to validate and verify product quality. Optical probes are non-destructive, non-contact diagnostics and particularly appropriate for probing materials destined for use in optoelectronic and photonic devices, where the interaction of light with the material provides the basis for device operation.

This conference will focus on the application of optical and related measuring techniques in nano- and micro-measurements, reliability study, failure analysis of MEMS/MOEMS and characterization with special emphasis in microelectronics, micromechanical structures and nanostructures. The complete research and development process including modeling, simulation, and implementation and testing shall be demonstrated on different examples. Special emphasis is directed to the development of new methods and algorithms into modern sensor systems. The application of these systems close-to-production is of general interest.

Topics will include:
  • wafer-scale metrology
  • holistic metrology
  • unification of modeling, simulation and measurement
  • interferometry, holography, speckle, Moir√© and grating imaging
  • classical microscopy and confocal systems for measurement
  • optical coherence tomography
  • scanning electron microscopy and thermal imaging
  • near-field scanning microscopy and atomic force microscopy
  • nanometric probes and nano-lithography
  • fiber optic sensors and waveguide devices
  • ellipsometry and scatterometry
  • image correlation
  • laser Doppler vibrometry and micro PIV
  • electro-optic techniques
  • Raman spectroscopy
  • polarimetry and scatterometry
  • optical phase conjugation
  • image processing
  • rigorous modeling and simulation
  • estimation of uncertainty of measurement
  • and others.


  • With applications in:
  • shape, contour, diameter, angle and length
  • temperature, pressure, refractive index and magnetic fields
  • micro- and nano topographic inspection
  • nano-scale measurements and thin films characterization
  • near-field optics, fluorescence, local spectroscopy
  • sub-wavelength structure inspection
  • overlay measurement
  • static and dynamic characterization of MEMS/MOEMS
  • metrology of microoptics
  • investigation of photonic structures and cavities
  • local analysis of material properties and defects including reliability aspects such fracture, fatigue and wear and life cycle predictability
  • contact and surface problems
  • failure analysis including identification of failure modes and mechanisms
  • reliability methodology and long term stability investigation of microstructures, devices and systems
  • deformation, displacement, vibration, stress, strain, fatigue and fracture, shock waves analysis
  • line width/cd-metrology, defectoscopy
  • line edge roughness measurement
  • fluid mechanics and microfluidics
  • reliability of microsystems
  • qualification of devices or systems and environmental testing
  • packaging and integration or/and interface to macro world
  • and others.
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